Flexible
thin-film transistors (TFTs) play an important role in
flexible integrated circuits (ICs). Hybrid integrated transistors
are highly desirable because of their high performance and simplified
process. However, TFTs with a hybrid integrated heterostructure of
single-crystalline semiconductor/organic dielectric layers have not
yet been discussed. In this work, a flexible hybrid TFT comprised
of a single-crystalline silicon nanomembrane (SiNM) semiconductor
and polystyrene (PS) gate dielectric was fabricated on a PET substrate.
The surface morphology of the PS dielectric layer on the PET substrate
was characterized by scanning electron microscopy (SEM) and atomic
force microscopy (AFM). The electrical characteristics of the dielectric
layer (PS) were also analyzed. SiNM was processed with a complementary
metal–oxide–semiconductor (CMOS)-compatible process
and subsequently transferred to the PET substrate with a PS/ITO stacked
layer to complete the assembly of the flexible hybrid SiNM/PS TFT.
The electrical properties of the flexible hybrid TFT were characterized
under different bending conditions (i.e., flat and bending radii of
21, 38.5, and 77.5 mm). Furthermore, the stress analysis of TFTs influenced
by a variation of the dielectric materials (i.e., PS, SiO2, and Al2O3), the adhesion conditions of the
SiNM/PS interface, and the dielectric thickness were also discussed.
The results revealed the potential of combining an organic polymeric
dielectric with inorganic single-crystalline nanomembranes to fabricate
high-performance flexible hybrid TFTs.