2017
DOI: 10.1007/s10854-017-7728-2
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Dielectric and thermal properties of epoxy resins with TiO2 nanowires

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Cited by 15 publications
(14 citation statements)
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“…Both these features can be enhanced by filling the epoxy resin with adequate particles. Besides the kind of filler, also the grain size, content and alignment in the matrix strongly influence the final properties of the polymer composite [4][5][6][7][8][9][10][11]. One of the most common kind of filler used for the epoxy system is the quartz flour [5,6,8,9].…”
Section: Introductionmentioning
confidence: 99%
“…Both these features can be enhanced by filling the epoxy resin with adequate particles. Besides the kind of filler, also the grain size, content and alignment in the matrix strongly influence the final properties of the polymer composite [4][5][6][7][8][9][10][11]. One of the most common kind of filler used for the epoxy system is the quartz flour [5,6,8,9].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, Xie et al demonstrated the effect of particle shape on the relative permittivity. Spherical nanoparticles of TiO 2 (1–4 wt%) showed a small increase in the permittivity of neat epoxy (up to 4.2 at 0.1 Hz), while TiO 2 nanowires at the same load resulted in a much larger increase in permittivity (up to 5.25 at 0.1 Hz) . The specific surface areas of the nanowires and nanoparticles were measured to be 39.8 and 82.6 m 2 g −1 , respectively.…”
Section: The Structure–property Relations In Epoxy Nanocompositesmentioning
confidence: 99%
“…Kochetov et al attributed this effect to phonon scattering on the larger surface area of nanoparticles, but this cannot be determined conclusively . Xie et al investigated the changes in thermal conductivity for epoxy nanocomposites with TiO 2 nanoparticles and nanowires. The thermal conductivity increased with increasing filler load in both cases, but the increase was larger for nanowires.…”
Section: The Structure–property Relations In Epoxy Nanocompositesmentioning
confidence: 99%
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“…In addition, the poor thermal conductivity of epoxy resin hinders its application in the field of electronic packaging . Various nanoparticles (such as nano‐alumina, nano‐silica, nano‐titanium dioxide, etc.) have been added into epoxy resin to improve the mechanical property, thermal conductivity, dielectric property and wear resistance by researchers.…”
Section: Introductionmentioning
confidence: 99%