Aluminosilicate‐epoxy resin composite as novel material for electrical insulation with enhanced mechanical properties and improved thermal conductivity

Rybak, Andrzej; Nieroda, Jolanta

doi:10.1002/pc.25167

Cited by 26 publications

(22 citation statements)

References 44 publications

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“…DSC thermograms corresponding to the dynamic curing at 10°C/min of (a) and epoxy conversions versus temperature (b) for all the systems studied. Epoxy resins are one of the most important thermosetting resins for many engineering applications, such as in electrical insulation [18,19] thanks to their superior mechanical properties and thermal/chemical stability, coupled with low curing induced shrinkage.…”

Section: Introductionmentioning

confidence: 99%

Hard epoxy thermosets obtained via two sequential epoxy-amine condensations

Konuray

García

Morancho

et al. 2019

European Polymer Journal

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A new family of dual-curable poly(β-hydroxyamine ether) thermosets based on amine-epoxy formulations has been prepared and characterized. Both curing stages consist in an epoxy-amine polycondensation, each having different reactivity. Whereas the first one is carried out at relatively low temperature using an aliphatic flexible amine, the second is carried out at high temperature with a rigid aromatic amine. The sequentiality of the curing and the stability of the intermediate materials can be established in the basis of the different nucleophilicity of the amines used. The aromatic amine, with a weakly nucleophilic character, is not able to react with epoxides during the first stage at low temperature. The intermediate and final materials exhibit a wide range of properties, thanks to the different glass transition of both epoxy-amine networks, and can be tuned by changing the relative proportion of both diamines in the formulation. The participation of the epoxy resin in both curing stages ensures the homogeneity of the prepared materials, rendering them excellent candidates for applications such as adhesives or smart materials.

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Section: Introductionmentioning

confidence: 99%

Hard epoxy thermosets obtained via two sequential epoxy-amine condensations

Konuray

García

Morancho

et al. 2019

European Polymer Journal

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“…Due to the flow of the electrical current through electrification components, as in cables and busbars, additional heat is generated, which can lead to malfunctioning or even the damaging of the electrical devices. Therefore, suitable thermal management in order to dissipate the excess of generated heat is a crucial issue for appropriate functionality of electrical apparatuses [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

“…Pure polymers exhibit a very low thermal conductivity, and the heat dissipation from the internal parts of electrical components to the outside is highly hindered. One of the approaches to enhance the thermal conductivity of polymer materials is the application of high thermally conductive fillers [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 ]. There are studies regarding the fabrication of heat shrinkable polymer composites with different fillers incorporated, such as carbon nanotubes (CNT) [ 25 ], nanoclay [ 26 ], glass fiber [ 27 ], and silicon carbide [ 28 , 29 ].…”

Section: Introductionmentioning

confidence: 99%

Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation

et al. 2021

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The evaluation of a possible application of functional shrinkable materials in thermally conductive electrical insulation elements was investigated. The effectiveness of an electron beam and gamma radiation on the crosslinking of a selected high density polyethylene grade was analyzed, both qualitatively and quantitatively. The crosslinked polymer composites filled with ceramic particles were successfully fabricated and tested. On the basis of the performed investigation, it was concluded that the selected filler, namely a boron nitride powder, is suitable for the preparation of the crosslinked polymer composites with enhanced thermal conductivity. The shape memory effect was fully observed in the crosslinked samples with a recovery factor reaching nearly 99%. There was no significant influence of the crosslinking, stretching, and recovery of the polymer composite during shape memory phenomenon on the value of thermal conductivity. The proposed boron nitride filled polyethylene composite subjected to crosslinking is a promising candidate for fabrication of thermally shrinkable material with enhanced heat dissipation functionality for application as electrically insulating components.

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“…The materials used as electrical insulation for a medium-voltage electrical apparatus have to combine many parameters, mainly, the dielectric, mechanical, and thermal parameters should be preserved. The correct selection of the polymer matrix, and especially, use Polymers 2021, 13, 2161 2 of 10 of an appropriate filler, allow the manufacture of multifunctional polymer composites for their application in electrical devices [7][8][9][10][11][12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Functional Polymer Composite with Core-Shell Ceramic Filler: II. Rheology, Thermal, Mechanical, and Dielectric Properties

Rybak

2021

Polymers

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Epoxy resin composites filled with ceramic particles are commonly applied in electrification devices as an electrical insulation. In order to maintain proper functionality of such apparatuses it is crucial to optimize a broad range of properties, such as thermal, mechanical and dielectric parameters. In an earlier paper, a novel core-shell filler was developed in order to enhance the thermal conductivity in the epoxy composite used as electrical insulation. The new filler was made of a standard material, which was covered by a thin layer of high thermally conductive shell, namely, alumina coated by aluminum nitride. It was previously shown that the epoxy resin filled with the core-shell Al2O3@AlN particles showed a significant increase in thermal conductivity with a 63% relative increase. In this paper, a set of complementary measurements was performed and analyzed, namely, rheology, tensile strength, dynamic mechanical analysis, and dilatometry. Moreover, the dielectric permittivity and strength, and electrical resistivity were investigated in order to check if the electrical insulation properties were maintained. The obtained results were compared with the epoxy composite filled with the standard filler. The rheological behavior of the core-shell filled system showed that the processability will not be hindered. The mechanical properties of the composite based on core-shell filler are better than those of the reference system. The coefficient of linear thermal expansion is lower for epoxy filled with core-shell filler, which can lead to better adhesion to internal parts in the electrification devices. The dielectric strength was enhanced by 16% for the core-shell filled epoxy. The investigation clearly demonstrates that the epoxy composite filled with the core-shell particles is an appropriate material for application as electrical insulation with enhanced thermal conductivity.

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Aluminosilicate‐epoxy resin composite as novel material for electrical insulation with enhanced mechanical properties and improved thermal conductivity

Cited by 26 publications

References 44 publications

Hard epoxy thermosets obtained via two sequential epoxy-amine condensations

Hard epoxy thermosets obtained via two sequential epoxy-amine condensations

Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation

Functional Polymer Composite with Core-Shell Ceramic Filler: II. Rheology, Thermal, Mechanical, and Dielectric Properties

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