Dielectric and thermal–mechanical properties of hybrid organic–inorganic polymer systems based on isocyanate-containing oligomers

Mamunya, Yevgen; Iurzhenko, Maksym; Lebedev, E. V.; Ischenko, S.S.; Boiteux, Gisèle; Seytre, Gérard

doi:10.1016/j.jnoncrysol.2007.03.031

Cited by 12 publications

(10 citation statements)

References 10 publications

(12 reference statements)

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“…Inorganic/organic composites have attracted much attentions owing to their advantages, which are merged from both inorganic and organic materials, as well as their great design ability . Many researches have proven that the integrated properties of composites mainly depend on the nature of organic and inorganic materials as well as that of the interface .…”

Section: Introductionmentioning

confidence: 99%

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Gao

Jiao

et al. 2011

Polymers for Advanced Techs

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High‐performance insulating materials have been increasingly demanded by many cutting‐edge fields. A new kind of high‐performance composites with high thermal conductivity, low coefficient of thermal expansion (CTE), and low dielectric loss was successfully developed, consisting of hexagonal boron nitride (hBN) and 2,2′‐diallylbisphenol A (DBA)‐modified 4,4′‐bismaleimidodiphenylmethane (BDM) resin. The effects of hBN and its content on the integrated properties, including curing behavior of uncured system, the CTE, thermal conductivity, dielectric properties, and thermal resistance of cured composites, are systematically investigated and discussed. Results show that there are amino groups on the surface of hBN, which supply desirable interfacial adhesion between hBN and BDM/DBA resin and a good dispersion of hBN in the resin. With the increase of the hBN content, the thermal conductivity increases linearly, whereas the CTE value decreases linearly; in addition, dielectric loss gradually decreases and becomes more stable over the whole frequency from 10 to 109 Hz. In the case of the composite with 35 wt% hBN, its thermal conductivity, CTE in glassy state, and dielectric loss are about 3.3, 0.63, and 0.5 times of the corresponding value of BDM/DBA resin, respectively. These attractive integrated properties suggest that hBN/BDM/DBA composites are high‐performance insulating materials, which show great potential in applications, especially for electronics and aerospace industries. Copyright © 2011 John Wiley & Sons, Ltd.

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Section: Introductionmentioning

confidence: 99%

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Gao

Jiao

et al. 2011

Polymers for Advanced Techs

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“…12,13 To date, some inorganic filler/CE composites have been studied such as aluminum borate whisker/CE, carbon nanotube/CE, polyhedral oligomeric silsesquioxane/CE, and polysalfone/CE, [14][15][16][17] and results have proved that these composites have better thermal properties than original CE resin. On the other hand, the effect of inorganic fillers on the dielectric properties of polymeric matrices has been investigated, 18,19 and results suggest that dielectric properties of inorganic/CE composites are greatly depended on that of inorganic materials.…”

Section: Introductionmentioning

confidence: 99%

Novel high‐performance wave‐transparent aluminum phosphate/cyanate ester composites

Sun

Huang

et al. 2011

J of Applied Polymer Sci

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Advanced wave-transparent composites are the key materials for many cutting-edge industries including aviation and aerospace, which should have outstanding heat resistance, low dielectric constant and loss as well as good mechanical properties. A novel kind of high-performance wave-transparent composites based on surface-modified aluminum phosphate AlPO 4 (KH-550) and cyanate ester (CE) was first developed. The dielectric and dynamic mechanical properties of AlPO 4 (KH-550)/CE composites were investigated intensively. Results show that AlPO 4 (KH-550)/ CE composites have decreased dielectric loss and higher storage moduli than pure CE resin; in addition, the composites with suitable AlPO 4 (KH-550) concentration remain the outstanding thermal property and low dielectric constant of pure CE resin. The reasons attributing to these results are discussed from the effects of AlPO 4 (KH-550) on the key aspects such as morphology, curing mechanism, and interfacial adhesion of composites.

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“…Otherwise, the hybrid network PIC/SS dominated in OIS with high values of reactivity R , and the general properties of OIS were prevalently defined by the properties of this network. Also, as it was shown in [13], the OIS with low values of R and, correspondingly, the dominant hybrid network MDI/SS contain nano-scale inclusions of the SS mineral phase, whereas the OIS with high values of R and, correspondingly, the dominant hybrid network PIC/SS contain micro-dimensional inclusions of the SS mineral phase. The nano-scale inclusions of the SS mineral phase in OIS with the dominant lowly cross-linked network MDI/SS have much highly developed specific active surface with higher number of charge carriers as compared to the micro-dimensional inclusions of the SS mineral phase in the OIS with the dominant highly cross-linked network PIC/SS.…”

Section: Discussionmentioning

confidence: 56%

“…Previously, we have reported that OIS synthesized by joint polymerization of various organic oligomers and sodium silicate (inorganic component) have different properties, depending on the formed hybrid structures [13-17]. Such OIS have also a high level of ionic conductivity in a wide temperature range due to an ionomeric polymer matrix (high-molecular-weight polyurethane) and presence of a number of the charge carriers, mainly sodium cations Na + , in a mineral phase.…”

Section: Introductionmentioning

confidence: 99%

Relaxation processes in hybrid organic-inorganic polymer nanosystems polymerized in situ

et al. 2014

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The relaxation processes of hybrid organic-inorganic polymer nanosystems (OIS) synthesized by joint polymerization of organic and inorganic components were studied using methods of differential scanning calorimetry (DSC), dynamic mechanical thermal analysis (DMTA), and broadband dielectric relaxation spectroscopy (DRS). The organic component was a mixture of two products: high-molecular-weight macrodiisocyanate (MDI) with low reactivity and low-molecular-weight isocyanate-containing modifier poly(isocyanate) (PIC) with high reactivity. Sodium silicate (SS) was used as inorganic component. The structures of the OIS obtained were in the form of hybrids with covalently connected building blocks and interpenetrating networks: weakly cross-linked network MDI/SS and highly cross-linked network PIC/SS. Depending on the MDI/PIC ratio, one of the networks was prevailing and created a continuous structure with domains of second network.

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Dielectric and thermal–mechanical properties of hybrid organic–inorganic polymer systems based on isocyanate-containing oligomers

Cited by 12 publications

References 10 publications

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity, low coefficient of thermal expansion, and low dielectric loss

Novel high‐performance wave‐transparent aluminum phosphate/cyanate ester composites

Relaxation processes in hybrid organic-inorganic polymer nanosystems polymerized in situ

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