Dicing Tape Performance in a Plasma Dicing Environment

Fulton, Stewart; Ansell, Oliver; Hopkins, Janet; Umemoto, Taku; Nishida, Takuo

doi:10.1109/eptc.2018.8654272

Cited by 6 publications

(3 citation statements)

References 10 publications

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“…As reported in the conference paper 'Dicing Tape Performance in a Plasma Dicing Environment' [17], all dicing tapes out-gas to varying degrees. This occurs as the volatile organic compounds (VOCs) within the base film & adhesive diffuse, sublime or vaporize and release as gases.…”

Section: Tape Robustness Testmentioning

confidence: 99%

“…The absence of adhesive banding on the stretched unexposed PO10 sample and its appearance on samples UV exposed or exposed to plasma within the plasma dicing module, suggested that the optical emissions spectra of certain plasmas can trigger the photo-initiated adhesive curing process otherwise known as adhesive cross-linking. The SEM analysis coupled with the elongation and tensile strength results reported in the conference paper 'Dicing Tape Performance in a Plasma Dicing Environment' [17] show that adhesive cross-linking occurs at different rates depending on the species of plasma used.…”

Section: The Tape Elongation Anomaly After Plasma Exposurementioning

confidence: 99%

“…As a furtherance to the adhesion strength measurements after substrate singulation tests, an additional set of experiments designed to measure the amount of force required to separate singulated die from the supporting tape after either saw dice or plasma dice singulation was completed at LINTEC R&D in Japan. The details and results of these tests were reported in the conference paper 'Dicing Tape Performance in a Plasma Dicing Environment' [17]. It was shown that pick-up force measured on PO10 tape from plasma diced dies are comparable with the same sized dies singulated using a saw dicing system.…”

Section: Tape Adhesion Strength After Substrate Singulationmentioning

confidence: 99%

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A Study of Integrated Circuit Dicing Tape When Used in a Plasma Dicing Environment

Fulton

Ansell

Hopkins

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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The main objective of this study was to establish which of the many dicing tapes used in the semiconductor industry, would be most suitable for use in plasma dicing. Tape design over the past 40 years has continually evolved through advancements in both dicing technologies and the incessant revision of integrated circuit packaging. Die singulation has traditionally been accomplished using a diamond saw, laser-based technology or combinations of both. The stress on dicing tape was therefore limited to fatigue through the physical nature of saw dicing or heat energies induced during laser dicing. These processes do not expose dicing tape to either high vacuum or a variety of plasma chemistry. This investigative work is a continuation of studies examining dicing tape behavior when employed for use in plasma dicing. Results show that Polyolefin (PO) UV-tape with low to medium adhesion strength exhibit the greatest resilience in harsh plasma etch conditions and that efficient photoinitiated cross-linking (or curing) of the adhesive is triggered if directly exposed to the photonic energies present in a pure SF6 plasma or full plasma dicing process. However, the post plasma dice, post UV cure adhesive strength can still be minimized if the tape manufacturers recommended time limitations between tape mount, plasma dice and the die pick-up process are adhered to.

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Section: Tape Robustness Testmentioning

confidence: 99%

Section: The Tape Elongation Anomaly After Plasma Exposurementioning

confidence: 99%

Section: Tape Adhesion Strength After Substrate Singulationmentioning

confidence: 99%

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