2022
DOI: 10.3390/ma15020415
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Diamond/GaN HEMTs: Where from and Where to?

Abstract: Gallium nitride is a wide bandgap semiconductor material with high electric field strength and electron mobility that translate in a tremendous potential for radio-frequency communications and renewable energy generation, amongst other areas. However, due to the particular architecture of GaN high electron mobility transistors, the relatively low thermal conductivity of the material induces the appearance of localized hotspots that degrade the devices performance and compromise their long term reliability. On … Show more

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Cited by 27 publications
(8 citation statements)
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References 170 publications
(250 reference statements)
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“…Many methods have been suggested, for example, developing diamond films to cover passivated GaN equipment, or diamond/GaN wafers for new generation equipment research and development. The prospect and difficult problem of science and technology of each method are reviewed by Mendes et al, and their advantages and disadvantages are introduced and discussed in detail [ 26 ].…”
Section: Diamond/gan Hemtsmentioning
confidence: 99%
“…Many methods have been suggested, for example, developing diamond films to cover passivated GaN equipment, or diamond/GaN wafers for new generation equipment research and development. The prospect and difficult problem of science and technology of each method are reviewed by Mendes et al, and their advantages and disadvantages are introduced and discussed in detail [ 26 ].…”
Section: Diamond/gan Hemtsmentioning
confidence: 99%
“…GaN and diamond are both wide band gap semiconductors with band gap values of 3.44 eV and 5.45 eV, respectively [10][11][12][13][14][15][16][17][18][19]. On the other hand, silicon has an intrinsic band gap of 1.12 eV with electron and hole mobilities of 1400 and 450 cm 2 /Vs, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…In spite of great progress, GaN and AlN wafers are still too expensive and limited in size; sapphire is cheaper but has a low thermal conductivity. Synthetic diamond, with its outstanding thermal conductivity and breakdown field, could be the best choice for high-power devices, but such wafers are limited in size as well, and fostering epitaxial growth on them is very challenging [ 8 , 9 ]. SiC and silicon are the remaining substrate options.…”
Section: Introductionmentioning
confidence: 99%