Diamond deposition at low substrate temperatures

Yarbrough, Walter A.; Badzian, Andrzej; Pickrell, David; Liou, Y.; Inspektor, A.

doi:10.1016/s0022-0248(08)80103-0

Cited by 27 publications

(2 citation statements)

References 11 publications

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“…20,21 Furthermore, in the Raman spectra of nanoscale diamonds and diamond nanoclusters, peaks also appear at 1140 and 1120 cm Ϫ1 , respectively. 22,23 Although Raman peaks relating to sp 3 bonds within the diamond structure exist at approximately 1000-1300 cm Ϫ1 , no Raman peak exists in the wave number region that corresponds to sp 2 bonding. The peak at approximately 1450 cm Ϫ1 is identical to that of Raman scattering observed for ion-implanted diamonds.…”

mentioning

confidence: 99%

Creation of nanodiamonds by single impacts of highly charged ions upon graphite

Meguro

Hida

Suzuki

et al. 2001

Applied Physics Letters

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mentioning

confidence: 99%

Creation of nanodiamonds by single impacts of highly charged ions upon graphite

Meguro

Hida

Suzuki

et al. 2001

Applied Physics Letters

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“…(CH 4 ) flow and 98 sccm hydrogen (H 2 ) flow. Sample seeding with ultrasonic dispersion of 0.25 µm improved the diamond nucleation rate [61][62][63][64]. The HFCVD diamond film grown over the TDVC coating was continuous and homogeneous in all sample surfaces without cracks and delamination, even for the thinner VC intermediate layer.…”

Section: Thermodiffused Vanadium Carbide Coating (Tdvc)mentioning

confidence: 97%

Interlayers Applied to CVD Diamond Deposition on Steel Substrate: A Review

et al. 2017

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Academics and industry have sought after combining the exceptional properties of diamonds with the toughness of steel. Since the early 1990s several partial solutions have been found but chemical vapor deposition (CVD) diamond deposition on steel substrate continues to be a persistent problem. The main drawbacks are the high carbon diffusion from gas phase into substrate, the transition metals on the material surface that catalyze sp 2 bond formation, instead of sp 3 bonds, and the high thermal expansion coefficient (TEC) mismatch between diamond and steels. An intermediate layer has been found necessary to increase diamond adhesion. Literature has proposed many efficient intermediate layers as a diffusion barrier for both, carbon and iron, but most intermediate layers shown have not solved TEC mismatch. In this review, we briefly discuss the solutions that exclusively work as diffusion barrier and discuss in a broader way the ones that also solve, or may potentially solve, the TEC mismatch problem. We examine some multilayers, the iron borides, the chromium carbides, and vanadium carbides. We go through the most relevant results of the last two and a half decades, including recent advances in our group. Vanadium carbide looks promising since it has shown excellent diffusion barrier properties, its TEC is intermediary between diamond and steel and, it has been thickened to manage thermal stress relief. We also review a new deposition technique to set up intermediate layers: laser cladding. It is promising because of its versatility in mixing different materials and fusing and/or sintering them on a steel surface. We conclude by remarking on new perspectives.

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Non-equilibrium thermodynamics and the vapor phase preparation of diamond for electronic applications

Yarbrough

1991

J. Electron. Mater.

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Diamond deposition at low substrate temperatures

Cited by 27 publications

References 11 publications

Creation of nanodiamonds by single impacts of highly charged ions upon graphite

Creation of nanodiamonds by single impacts of highly charged ions upon graphite

Interlayers Applied to CVD Diamond Deposition on Steel Substrate: A Review

Non-equilibrium thermodynamics and the vapor phase preparation of diamond for electronic applications

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