Diamond Cutting of Silicon with Nanometric Finish

Fang, Fengzhou; Venkatesh, V.C.

doi:10.1016/s0007-8506(07)62782-6

Cited by 162 publications

(72 citation statements)

References 9 publications

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“…They found that rake angle effect diminishes at a depth of cut of 100 nm and becomes prominent from 100 nm to 1 μm in all crystallographic orientations. Zang et al [9] suggested the importance of effective rake angle in association with cutting edge radius and depth of cut. Using 0°rake angle and − 25°rake angle tools, they observed surface deterioration for an effective rake angle of~− 60°rake using − 25°tool and surface finish of 1 nm using lower negative effective rake angle.…”

Section: Introductionmentioning

confidence: 99%

Investigation of influence of tool rake angle in single point diamond turning of silicon

Mir

Luo

Cheng

et al. 2017

Int J Adv Manuf Technol

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This paper presents an investigation of the effect of tool rake angle in single point diamond turning (SPDT) of silicon using experimental and simulation methods. Machining trials under the same cutting conditions were carried out using three different rake angle tools. In order to delve further into the rake angle effect on the output parameters including material removal, stresses and crack formation, at the onset of chip formation and steady-state conditions, a simulation study using smoothed particle hydrodynamics (SPH) approach was performed. The simulation results were incorporated and found in good agreement with experimental observations. The results indicate that diamond tool wear rate and surface generation mechanism significantly vary using different rake angle tools. The continuance of compressive and shear deformation sequence at the chip incipient stage governs the high-pressure phase transformation (HPPT) as a function of rake angle and tool wear. The capability of diamond tool to maintain this sequence and required hydrostatic pressure under worn conditions is highly influenced by a change in rake angle. The proportional relationship of cutting force magnitude and tool wear also differs owing to disparate wear pattern which influence distribution of stresses and uniform hydrostatic pressure under the tool cutting edge. This subsequently influences structural phase transformation and therefore frictional resistance to cutting. Mainly frictional groove wear was found dominant for all diamond tools in machining of silicon.

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Section: Introductionmentioning

confidence: 99%

Investigation of influence of tool rake angle in single point diamond turning of silicon

Mir

Luo

Cheng

et al. 2017

Int J Adv Manuf Technol

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show abstract

“…In 1998, Fang et al [94] propose that the hydrostatic pressure under the tool edge is beneficial to cutting brittle materials in ductile region. It is proved that the area of the hydrostatic pressure zone extends with the increase in cutting tool edge radius by finite element modeling of the silicon [82].…”

Section: Influence On Stressmentioning

confidence: 99%

“…In nanocutting process, Fang et al [5,94,113] investigated the influence of the tool edge radius on nano-cutting mechanism by both molecular dynamics analysis and experimental study. The results showed that the atoms are extruded in front of the cutting tool, when the UCT is 1 nm and edge radius is 5 nm.…”

Section: Influence On Chip Formation and Minimum Uctmentioning

confidence: 99%

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Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

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Micro-and nano-machining technology has been applied in industry to generate high-precision parts with micro/nanometric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro-and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the indepth understanding of the micro/nano-cutting process.

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“…To avoid the influence of tool radius and to obtain a surface with superior form accuracy, the geometry of the diamond tool nose must be considered, since it is not an ideal point but a half-cylinder with radius R [17] and [18]. In fact, by projecting points of the planar spiral on the desired surface, cutting contact points can then be obtained.…”

Section: Fig 2 Path Of Tool Contact Points For Sinusoidal Ring Surfacementioning

confidence: 99%

Ultra-Precision Machining of a Large Amplitude Sinusoidal Ring Surface Based on a Slow Tool Servo

Zhao

et al. 2016

SV-JME

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Diamond Cutting of Silicon with Nanometric Finish

Cited by 162 publications

References 9 publications

Investigation of influence of tool rake angle in single point diamond turning of silicon

Investigation of influence of tool rake angle in single point diamond turning of silicon

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Ultra-Precision Machining of a Large Amplitude Sinusoidal Ring Surface Based on a Slow Tool Servo

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