Device interconnection technology for advanced thermal conduction modules

Ray, Siddharth S.; Beckham, K.; Master, R.N.

doi:10.1109/33.159870

Cited by 16 publications

(3 citation statements)

References 8 publications

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“…One of the most promising technologies of todayÕs chip-level interconnection is flip-chip technology, which has emerged as a low cost, high density, and high performance interconnection method for integrated-circuit chip [1][2][3][4]. Since the electronic package may undergo operation conditions of thermal/power cycling, the thermal expansion mismatch between the adjacent components causes cyclic loading on the solder joints, which can potentially lead to the temperature 0026-2714/$ -see front matter Ó 2004 Elsevier Ltd. All rights reserved.…”

Section: Introductionmentioning

confidence: 99%

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Lin

Chen

Liu

et al. 2005

Microelectronics Reliability

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Section: Introductionmentioning

confidence: 99%

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Lin

Chen

Liu

et al. 2005

Microelectronics Reliability

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“…15 shows the electrical resistance increase slopes for a typical single bump barrel-shaped solder joint, stacked hourglassshaped solder joint and stacked barrel-shaped solder joint. The slope of this particular single bump barrel-shaped solder joint is over 6 , while those of the stacked hourglass-shaped and stacked barrel-shaped solder joint examples are in the range of [3][4] . Fig.…”

Section: B Results On Temperature Cycling Testmentioning

confidence: 99%

“…O NE OF THE most promising technologies of today's chip-level interconnection is flip-chip technology, which has emerged as a low-cost, high density, and high performance interconnection method for integrated-circuit chips [1]- [3]. Ball-grid array (BGA) becomes the choice of the first-level and second-level interconnection as the trend toward higher input/output (I/O), higher performance, and higher yield continues [2], [4].…”

Section: Introductionmentioning

confidence: 99%

Effects of solder joint shape and height on thermal fatigue lifetime

Liu

Lü

2003

IEEE Trans. Comp. Packag. Technol.

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Solder joint thermal fatigue failure is a major concern for area array technologies such as flip chip and ball grid array technologies. Solder joint geometry is an important factor influencing thermal fatigue lifetime. In this paper, the effects of solder joint shape and height on thermal fatigue lifetime are studied. Solder joint fatigue lifetime was evaluated using accelerated temperate cycling and adhesion test. Scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), scanning acoustic microscopy (nondestructive evaluation) and optical microscopy were utilized to examine the integrity of the joint and to detect cracks and other defects before and during accelerated fatigue tests. Our accelerated temperature cycling test clearly shows that solder joint fatigue failure process consists of three phases: crack initiation, crack propagation and catastrophic failure. Experimental results indicated that both hourglass shape and great standoff height could improve solder joint fatigue lifetime, with standoff height being the more effective factor. Experimental data suggested that shape is the dominant factor affecting crack initiation time while standoff height is the major factor influencing crack propagation time.

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