Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Chen, Xu; Lin, Yanwei; Liu, Xingsheng; Lü, Gongxuan

doi:10.1016/j.engfracmech.2005.02.008

Cited by 25 publications

(20 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Also, tin-lead hot air solder levelling (HASL) has been replaced with lead-free PCB surface finishes. The combined switch has added extra concern in terms of reliability, as most failures of chip devices occur at the weak interface intermetallic between the component and the pad (Abtew and Selvaduray, 2000;Stepniak, 2002;Chen et al, 2005;Qi et al, 2006).…”

Section: Introductionmentioning

confidence: 99%

Surface finish effect on reliability of SAC 305 soldered chip resistors

Collins

Punch²,

Coyle³

2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to assess the long-term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic chip resistors soldered to printed circuit boards (PCBs) using three different Pb-free surface finishes: organic solderability preservative (OSP), immersion silver (IAg) and electroless nickel immersion gold (ENIG). Design/methodology/approach -Two populations of solder joints were monitored continuously during a thermal cycle of 08C to 1008C with a ramp rate of 108C/min and a 30 min dwell at the temperature extremes. One population was cycled to 2,500 cycles, the other population was cycled to 8,250 cycles. Failures were defined in accordance with the IPC-9701A industry test guidelines and failure data are reported as characteristic life, h. Microstructural evolution was characterised using metallographic techniques and back-scattered scanning electron microscopy (SEM). Fractography was performed on post-cycled resistors to determine failure mechanisms. Findings -The results showed that the lifetime of the chip resistors could be ranked as follows: OSP . ENIG . IAg after 8,250 thermal cycles, when . 73 per cent of the population had failed. It was found that the relative performance of OSP finishes improved with longer periods of cycling. This was attributed to diffusion of copper into the bulk solder and which subsequently, over time, acted as a dispersion strengthening mechanism. The relatively poor performance of IAg finishes was attributed to void formation. Originality/value -The paper provides new and valuable information to end-users about the long-term reliability of lead-free solder on three commonly used lead-free surface finishes. The performance of each surface finish is explained in terms of microstructural evolution and void formation.

show abstract

Section: Introductionmentioning

confidence: 99%

Surface finish effect on reliability of SAC 305 soldered chip resistors

Collins

Punch²,

Coyle³

2012

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…[17] In the reliability evaluation of electronic packaging, the failure criterion is often decided by considering the electrical resistance of the interconnect. [15,16] To this end, fatigue tests were conducted using a custombuilt micromechanical fatigue tester with in situ electrical resistance measurements(see Figure S2 in Supporting Information). The fatigue tester comprised an electro-dynamic, vertical axial loading machine with a laser displacement sensor (Keyence LK-G30), and a Keithley 2700 multi-meter with a four-wire measurement setting was used for in situ electrical resistance measurement of the conductive sample during cyclic loading.…”

Section: Micro Fatigue Testermentioning

confidence: 99%

“…For this reason, the electrical resistance of interconnects is often used as a failure criterion in studies on the reliability of electronics packaging. [15,16] Thus, the fatigue behavior of conductive materials for electronic devices should be inspected by considering the electrical resistance variations under cyclic loading. To simulate operational use, fatigue tests were carried out with in-situ electrical resistance measurements, with the test results represented through a normalized electrical resistance (R/R 0 ) as a function of the fatigue cycle.…”

Section: Introductionmentioning

confidence: 99%

The Feasibility of Healable Electronics and Mechanical Behavior of Silver Nanowire (AgNW)/Healable Polymer Composite

Bae

Lee

Li³

et al. 2018

Adv Materials Technologies

View full text Add to dashboard Cite

The future of electronics is expected to include healable and wearable devices and systems.To realize this futuristic perspective, several smart conductive materials possessing the This article is protected by copyright. All rights reserved. characteristics of being healable, flexible and/or stretchable, have been introduced. Silvernanowire (AgNW) healable polymer composite is one of the more promising candidates for this class of material. We have demonstrated this ability of AgNW polymer composite to be healable under practical operating conditions. Specifically cracks induced by both mechanical and electrical loading were demonstrated to be healed by thermal treatment. Furthermore, a fatigue test of the AgNW healable conductor was conducted to investigate its mechanical behavior, an important prerequisite for the deployment of new materials. As a proof of concept, a healable touch panel was fabricated to demonstrate its feasibility, laying a stepping stone for future healable electronics.

show abstract

“…These results may be associated with the fact that the compliant hollow bumps could absorb a certain amount of deformation energy from the solder joints, and transfer some to the AlN tiles of the DBC substrates. This is because a flexible PCB was reported to absorb some deformation energy of a flip chip assembly, and thus, slow the growth of cracks and improve the thermal fatigue lifetime of the corresponding solder joints subjected to thermal cycling [33].…”

Section: ) Effect Of Initial Stress and Strain State In Dbc Substratesmentioning

confidence: 99%

Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects

Castellazzi

Dai

et al. 2015

IEEE Trans. Power Electron.

View full text Add to dashboard Cite

A stacked substrate-chip-bump-chip-substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In this paper, special effort has been devoted to material selection and geometric shape of the bumps in the design for improving the thermomechanical reliability of a highly integrated bidirectional switch. Results from 3-D finite-element simulation indicate that for all design cases the maximum von Mises stresses and creep strain accumulations occur in the solder joints used to join bumps on IGBTs during a realistic mission profile, but occur in the solder joints used to join bumps on DBC substrates during accelerated thermal cycling. The results from both the simulation and the accelerated thermal cycling experiments reveal that selection of Cu/Mo/Cu composite brick bumps in the stacked assembly can significantly improve the thermomechanical reliability of both the solder joints and the DBC substrates when compared to Cu cylinder bumps and Cu hollow cylinder bumps reported in previous work. Such results can be attributed to the effective reduction in the extent of mismatch of coefficients of thermal expansion between the different components in the assembly.Index Terms-Cu/Mo/Cu composite, finite-element (FE) method, integration, thermal cycling, wirebond-less packaging.

show abstract

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Cited by 25 publications

References 24 publications

Surface finish effect on reliability of SAC 305 soldered chip resistors

Surface finish effect on reliability of SAC 305 soldered chip resistors

The Feasibility of Healable Electronics and Mechanical Behavior of Silver Nanowire (AgNW)/Healable Polymer Composite

Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects

Contact Info

Product

Resources

About