2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897464
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Developments of high-Bi alloys as a high temperature Pb-free solder

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Cited by 8 publications
(2 citation statements)
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“…Low-melting (138 °C) tin–bismuth eutectic is appreciated for low-temperature assemblies. Bi-based alloys are also candidates for lead-free high-temperature applications: BiAg, BiSbCu, and BiCuSn …”
Section: Introductionmentioning
confidence: 99%
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“…Low-melting (138 °C) tin–bismuth eutectic is appreciated for low-temperature assemblies. Bi-based alloys are also candidates for lead-free high-temperature applications: BiAg, BiSbCu, and BiCuSn …”
Section: Introductionmentioning
confidence: 99%
“…Bi-based alloys are also candidates for lead-free high-temperature applications: BiAg, 11 BiSbCu, 10 and BiCuSn. 12 Numerous studies focused on the synthesis and the thermal decomposition of bismuth oxalates in the last decades. The thermolysis in air of Bi-containing mixed oxalates proved to be a promising chemical route for the preparation of high-T c superconducting oxides 13−15 and ferroelectric materials.…”
Section: ■ Introductionmentioning
confidence: 99%