Developments of Bi-Sb-Cu alloys as a high-temperature Pb-free solder

Cho, Junghyun; Mallampati, Sandeep; Schoeller, Harry; Yin, Liang; Shaddock, David

doi:10.1109/ectc.2015.7159757

Cited by 4 publications

(6 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Moreover, Jun Shen reported that Cu addition decreased melting point and refined microstructure, which resulted in an increase in both ultimate tensile strength and ductility of Sn-Bi-based alloy [31]. Development of Pb-free alloys using high Cu content (4-20 wt.%) has been carried out by several researchers [32][33][34][35][36]. Among them, Li Yang et al [36] studied microstructure evolution and shear strength of solder joint using In-Sn-20Cu composite particles by transient liquid phase (TLP) bonding.…”

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

View full text Add to dashboard Cite

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

show abstract

Section: Introductionmentioning

confidence: 99%

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Han

Shen

Huo

et al. 2021

Metals

View full text Add to dashboard Cite

show abstract

“…Because of these health and environmental concerns, the low toxicity of bismuth makes it attractive and seriously considered as a replacement for lead in electronic devices. 9,10 Pure bismuth is known for its brittleness, high electrical resistivity, and low thermal conductivity. 10 It is also known for lowering the melting point of the metals it is alloyed with, so bismuth is mostly used as an alloying element in soldering applications.…”

Section: ■ Introductionmentioning

confidence: 99%

“…Bismuth is a low melting-point metal ( T m = 271.4 °C) the use of which in electronic packaging has been accentuated by needs for Restriction of Hazardous Substances (RoHS, European Union directive) compliance. Because of these health and environmental concerns, the low toxicity of bismuth makes it attractive and seriously considered as a replacement for lead in electronic devices. , Pure bismuth is known for its brittleness, high electrical resistivity, and low thermal conductivity . It is also known for lowering the melting point of the metals it is alloyed with, so bismuth is mostly used as an alloying element in soldering applications.…”

Section: Introductionmentioning

confidence: 99%

“…Low-melting (138 °C) tin–bismuth eutectic is appreciated for low-temperature assemblies. Bi-based alloys are also candidates for lead-free high-temperature applications: BiAg, BiSbCu, and BiCuSn …”

Section: Introductionmentioning

confidence: 99%

“…9,10 Pure bismuth is known for its brittleness, high electrical resistivity, and low thermal conductivity. 10 It is also known for lowering the melting point of the metals it is alloyed with, so bismuth is mostly used as an alloying element in soldering applications. Low-melting (138 °C) tin−bismuth eutectic is appreciated for low-temperature assemblies.…”

Section: ■ Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Bi₂(C₂O₄)₃·7H₂O and Bi(C₂O₄)OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth

et al. 2017

View full text Add to dashboard Cite

Two bismuth oxalates, namely, Bi(CO)·7HO and Bi(CO)OH, were studied in terms of synthesis, structural characterization, particle morphology, and thermal behavior under several atmospheres. The oxalate powders were produced by chemical precipitation from bismuth nitrate and oxalic acid solutions under controlled pH, then characterized by X-ray diffraction (XRD), temperature-dependent XRD, IR spectroscopy, scanning electron microscopy, and thermogravimetric differential thermal analyses. New results on the thermal decomposition of bismuth oxalates under inert or reducing atmospheres are provided. On heating in nitrogen, both studied compounds decompose into small bismuth particles. Thermal properties of the metallic products were investigated. The Bi(CO)OH decomposition leads to a Bi-BiO metal-oxide composite product in which bismuth is confined in a nanometric size, due to surface oxidation. The melting point of such bismuth particles is strongly related to their crystallite size. The nanometric bismuth melting has thus been evidenced ∼40 °C lower than for bulk bismuth. These results should contribute to the development of the oxalate precursor route for low-temperature soldering applications.

show abstract