Development of terahertz pulse time-domain reflectometry system for transmission line failure analysis

Okada, T.; Nishina, S.; Ataka, Tsuyoshi; Hashimoto, Masataka; Irisawa, Akiyoshi; Imamura, Makoto

doi:10.1109/irmmw-thz.2015.7327931

Cited by 7 publications

(4 citation statements)

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“…Ultrafast THz pulses were used in combination with TDR to resolve failure points with a resolution surpassing conventional electrical TDR method alone. 142 Nondestructive FA of advanced 3D packaging still became more challenging to perform due to the much smaller interconnects such as TSV and microbump for both electrical and physical inspection methods even for ultrasfast laser pulses. For accurate analysis, there are two major challenges in realizing a THz-TDR system.…”

Section: Time-domain Reflectancementioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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Terahertz radiation for inspection and fault detection has been of interest for the semiconductor industry since the first generation and detection of THz signals. Until recent hardware advances, THz systems lacked the signal quality and reliability for use as an effective nondestructive testing (NDT) method. Incremental advances in THz sources, detectors, and signal processing resulted in the successful applied-industrial use of THz NDT techniques on carbon fiber laminates, automotive coatings, and for detection of counterfeit pharmaceutical tablets. Semiconductor inspection and verification methods ensure the functionality and thereby safety of vital electronics for several critical industries. For this reason, the reliability and verification of a THz NDT method must exceed currently used inspection systems. With recent laboratory access to THz radiation, THz inspection methods are often compared with existing optical, electrical, and volumetric semiconductor verification techniques for their production monitoring and failure analysis viability. This review will cover THz techniques and their applications at the printed circuit board (PCB), integrated circuit (IC), and transistor/gate scales. The THz radiation gap spans between optical and electronic ranges with a millimeter-sized wavelength allowing for adequate penetration of plastic and ceramic and semiconductor materials. THz radiation can be used to determine structural features, electrical signatures in the THz range, and chemical information simultaneously. Cost and environmental limitations restricted the ability for THz NDT semiconductor inspection methods to escape the lab and succeed in the dynamic environment of a semiconductor fabrication environment. Hybridized metrology methods incorporating information from multiple inspection tools are a regime where THz spectral and structural data can be combined with existing methods such as optical, x-ray, or E-beam. THz can be used initially to offer support to the complex failure analysis and verification requirements of the semiconductor industry from nanoscale to macroscale features and components. For THz systems to become independent inspection tools used for semiconductor production monitoring, in the lab or fab, this will require a confident level of statistical process control for THz signal generation, detection, or processing. Applied industrial semiconductor device inspection will likely be a result of a combination of research into THz hardware, reconstruction techniques, and the widespread application of machine learning techniques. Many breakthroughs occurred over the years to enable successful nondestructive characterization and inspection of semiconductor devices from the nanoscale transistors to fully packaged integrated circuits and assembled PCBs.

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Section: Time-domain Reflectancementioning

confidence: 99%

Review of THz-based semiconductor assurance

True

Jessurun

et al. 2021

Opt. Eng.

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“…As reviewed in (Du, Nagose, Bloom, & Julson, 2017), various techniques to diagnose electrical connectivity issues have been developed over the years (Chung, Amarnath, & Furse, 2009;Chung, Furse, & Pruitt, 2005;Furse et al, 2003;Furse, Chung, Lo, & Pendalaya, 2006;Okada et al, 2015;Shi & Kanoun, 2014;Smail, Hacib, Pichon, & Loete, 2011;Smail, Pichon, Olivas, Auzanneau, & Lambert, 2010;Smith, Furse, & Gunther, 2005;Tsai, Lo, Chung, & Furse, 2005;Will & Rolfes, 2013). These techniques detect whether a wire becomes open, a connector is disconnected, or a wire is shorted to the ground.…”

Section: Previous Workmentioning

confidence: 99%

“…For example, (Chung et al, 2009) detects these issues by measuring properties such as inductance, resistance, conductance, capacitance or impedance. References (Will & Rolfes, 2013;Furse et al, 2006;Shi & Kanoun, 2014;Smail et al, 2010Smail et al, , 2011Okada et al, 2015) measure characteristics of transmission or reflection signals generated from active or passive electrical signals through the circuit to detect connectivity issues. Two fundamental techniques have been developed, namely time-domain transmissometry (TDT) and time-domain reflectometry (TDR).…”

Section: Previous Workmentioning

confidence: 99%

“…Two fundamental techniques have been developed, namely time-domain transmissometry (TDT) and time-domain reflectometry (TDR). TDT (Will & Rolfes, 2013) monitors the transmission characteristics of an electrical signal to determine the fault severity, while TDR (Furse et al, 2006;Shi & Kanoun, 2014;Smail et al, 2010Smail et al, , 2011Okada et al, 2015) measures the amplitude and the timing of the reflected signal to determine the location and the type of the fault. Techniques using frequency-domain characteristics to detect faults in electrical connectivity, referred to as frequency-domain transmissometry (FDT) or frequencydomain reflectometry (FDR) (Furse et al, 2003;Chung et al, 2005;Tsai et al, 2005), have also been developed.…”

Section: Previous Workmentioning

confidence: 99%

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Electric Power Steering Power Circuit Health Assessment and Mitigation Strategy

et al. 2021

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With recent developments of energy efficient design and control for electric motors, electrical subsystems and components have become integral parts of main actuators in vehicle systems (e.g., steering and propulsion systems). To ensure proper vehicle operations, it is important to make sure that electrical power is properly transmitted through the power circuit from vehicle power source to the electric motor. However, degradation in the power circuit health, which often manifests itself as increased resistance, may affect power transmission and degrade the system performance. For example, in Electric Power Steering (EPS) systems, if the EPS power circuit resistance is increased and the EPS is drawing power to assist the driver, voltage at the EPS module will drop significantly, causing the EPS to reset and, consequently, Loss of Assist (LOA) incidents. Due to compliance in the steering system and suspension design, drivers often feel that the steering system is fighting back when an LOA incident occurs. While previous work has partially addressed this issue by developing algorithms that estimate resistance increase in EPS power circuits, this paper further validates and refines the algorithms for vehicle on-board and off-board implementations using test drive data collected. Since on-board and off-board implementations impose different limits on signal sampling rates, a total of 250 and 465 minutes of data are respectively collected with various vehicle speeds and steering maneuvers. Moreover, a supervisory control solution, referred to as EPS Anti-Loss-of-Assist (ALOA), is proposed that gradually and proactively reduces EPS torque assist as resistance in the EPS power circuit increases so that the EPS voltage is kept above a resetting threshold. Stationary steering tests of the proposed solution as well as demonstrations on parking lot maneuvers at General Motors Milford Proving Grounds are conducted. The stationary steering tests and demonstrations show that, with the proposed supervisory control, negative effects of increased EPS power circuit resistance can be mitigated without noticeable changes in normal driving experience.

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