Development of Single Step Grinding System for Large Scale ϕ300 Si Wafer: A Total Integrated Fixed-Abrasive Solution

Eda, Hiroshi; Zhou, Li; Nakano, Hirotami; Kondo, Rieko; Shimizu, Jun; Nagao, T.

doi:10.1016/s0007-8506(07)62110-6

Cited by 44 publications

(14 citation statements)

References 3 publications

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“…The grinding experiments were carried out on a horizontal type ultra-precision grinding machine as shown in Fig. 2 (a) (Eda, et al, 2001). The grinding machine was equipped with two aerostatic spindles for work and wheel rotation, and had two degrees of freedom along X-and Z-axis directions.…”

Section: Experimental Description and Resultsmentioning

confidence: 99%

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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Silicon (Si) is a fundamental material in the semiconductor industry. The advancement of semiconductor devices have offered convenience and comfort to our life. In order to raise productivity and economic efficiency, the semiconductor industry keeps looking for use of larger size Si wafers. The next generation wafer is expected to be sized as large as 450 mm in diameter. Many wafering processes including lapping, grinding and polishing have been studied and grinding technology stands out as the most promising process for large-size Si wafer manufacturing. In the current in-feed grinding scheme adopted for Si wafers, the wheel diameter used is generally equal to or larger than the wafer diameter. In turn, larger diameter wheels require larger size machine tools and production lines, which lead to increase in manufacturing costs. In this paper, both experiment and kinematical analysis have been carried out to investigate the feasibility of using small diameter grinding wheels to grind large size Si wafers, mainly focusing on the effects of wheel diameter on wafer geometry and surface roughness. The results show that both wheels generated a central convex profile on the wafer and the small wheel achieved a slightly better flatness than the large wheel. The surface roughness were similar one to another for most area of the wafer except the fringe around its edge. All these experimental results were predicable by the kinematic model established in this paper. Particularly, the kinematic analysis found that the cutting path made by small wheel with diameter equaling to the wafer radius was parallel each other at the fringe around wafer edge, which directly worsened the surface roughness.

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Section: Experimental Description and Resultsmentioning

confidence: 99%

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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show abstract

“…Despite the aggressive nature of grinding, it represents a critical manufacturing process that is widely used in finishing workpieces [16]. It is also an effective approach when compared with etching and lapping techniques in the semiconductor industry [17] and there is a drive to move away from traditional machining processes towards grinding [18]. A two-dimensional (2D) schematic illustrating the mechanics underlying the conventional metalcutting process is depicted in Figs 1 and 2.…”

Section: Energy Dissipation In Metal Cuttingmentioning

confidence: 99%

Methodology for adapting metal cutting to a green economy

Rao

2010

Proceedings of the Institution of Mechanical Engineers, Part B:

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The advent of global warming, as attested by the Intergovernmental Panel on Climate Change (IPCC), has serious ramifications for various facets of the human endeavour.Manufacturing is one such activity that is poised to undergo significant changes for curbing green-house gas emissions. This paper presents schemes for reducing the energy consumed in machining and grinding operations -the workhorses of any typical manufacturing set-up. These schemes are based on the mechanics of the metal cutting process which have been well studied over the years. Besides lowering the energy drawn from national grids, such schemes will pave the way for improved energy-efficient manufacturing processes. In the foreseeable future, alternative fuel systems to power manufacturing processes together with both newer operations and schemes, such as those outlined in this effort, would have a positive impact on the energy consumption of the manufacturing sector.

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“…The machine configuration for spindle angle adjustments illustrated in Fig. 6 was described by Tonshoff et al [17] and Eda et al [18]. Spindle angle adjustments are carried out by tilting the wheel rotation axis around the adjustment axes: the X-and Y-axes.…”

Section: Machine Configurations For Spindle Angle Adjustmentsmentioning

confidence: 99%

Fine grinding of silicon wafers: machine configurations for spindle angle adjustments

Sun

Pei

Fisher

2005

International Journal of Machine Tools and Manufacture

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Development of Single Step Grinding System for Large Scale ϕ300 Si Wafer: A Total Integrated Fixed-Abrasive Solution

Cited by 44 publications

References 3 publications

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Methodology for adapting metal cutting to a green economy

Fine grinding of silicon wafers: machine configurations for spindle angle adjustments

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