Fine grinding of silicon wafers: machine configurations for spindle angle adjustments

Sun, Wangping; Pei, Zhijian; Fisher, Graham R.

doi:10.1016/j.ijmachtools.2004.06.013

Cited by 28 publications

(19 citation statements)

References 10 publications

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“…94 The TTV of ultrathin wafers after grinding is determined by the contact angle between the grinding wheel and silicon wafer surface. 82, 97,98 The thickness variations in the wafer, glass carrier, and temporary adhesive have an influence on the contact angle. Disco developed an automatic wafer thickness uniformity feedback process for improving TTV (auto-TTV) especially for ultrathin wafers.…”

Section: Types Of Backgrindingmentioning

confidence: 99%

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Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

Marks

Hassan

Cheong

2015

Critical Reviews in Solid State and Materials Sciences

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Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 mm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.

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Section: Types Of Backgrindingmentioning

confidence: 99%

“…Disco developed an automatic wafer thickness uniformity feedback process for improving TTV (auto-TTV) especially for ultrathin wafers. 97,98 Figure 22 explains auto-TTV process. After grinding some amount of Si wafer, the initial TTV is measured using a non contact gauge (NCG).…”

Section: Types Of Backgrindingmentioning

confidence: 99%

Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

Marks

Hassan

Cheong

2015

Critical Reviews in Solid State and Materials Sciences

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“…In practice, on any commercially available wafer grinders, spindle angle adjustments (to change the angle between the wheel rotation axis and the wafer rotation axis) based on the wafer shape ground is almost inevitable in order to achieve flat wafers [15][16][17].…”

Section: Consistent Performancementioning

confidence: 99%

Grinding wheels for manufacturing of silicon wafers: A literature review

Liu

Pei

Fisher

2007

International Journal of Machine Tools and Manufacture

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Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry. The stringent requirements for these grinding wheels include low damage on ground surfaces, self-dressing ability, consistent performance, long wheel lives, and low prices. This paper presents a literature review on grinding wheels for manufacturing of silicon wafers. It discusses recent development in abrasives, bond materials, porosity formation, and geometry design of the grinding wheels to meet the stringent requirements.

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“…A major reason to adjust the spindle angles is that the chuck material is different from silicon and, therefore, the grinding force when grinding the chuck is different from that when grinding the wafers. Further discussion on spindle angle adjustments can be found in other papers (18,19). r chuck , h chuck : radius and depth of the dimple on the chuck (formed when the chuck is ground).…”

Section: Solutions To Eliminate or Reduce Central Bumpsmentioning

confidence: 99%