Development of Silicon Micromachined Microlens Antennas at 1.9 THz

Alonso‐delPino, Maria; Reck, Theodore; Jung-Kubiak, Cecile; Lee, Choonsup; Chattopadhyay, Goutam

doi:10.1109/tthz.2017.2655340

Cited by 35 publications

(23 citation statements)

References 18 publications

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“…Additionally, the detector array is not very sensitive to cosmic ray interaction with an expected loss of integration time of less than 0.6% when operated in L2 orbit. This device and assembly can be scaled and used for the higher frequency bands (up to 10 THz) of SPICA-SAFARI [ 1 ] after implementing some modifications: (i) the CPW section of the KID close to the antenna needs to be made with electron beam lithography in order to make 300-nm lines; (ii) the gap between the lens and the antenna needs to be reduced down to 1 m, which can be done using a spinnable and patternable bonding adhesive; (iii) the alignment between the lens and the antenna needs to be improved down to a few m, which can be done using micromachined Si springs [ 17 ]. In summary, this array fulfils many generic requirements for future THz and sub-mm wave space-based observatories.…”

Section: Discussionmentioning

confidence: 99%

Ultrasensitive Kilo-Pixel Imaging Array of Photon Noise-Limited Kinetic Inductance Detectors Over an Octave of Bandwidth for THz Astronomy

et al. 2018

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We present the development of a background-limited kilo-pixel imaging array of ultrawide bandwidth kinetic inductance detectors (KIDs) suitable for space-based THz astronomy applications. The array consists of 989 KIDs, in which the radiation is coupled to each KID via a leaky lens antenna, covering the frequency range between 1.4 and 2.8 THz. The single pixel performance is fully characterised using a representative small array in terms of sensitivity, optical efficiency, beam pattern and frequency response, matching very well its expected performance. The kilo-pixel array is characterised electrically, finding a yield larger than 90% and an averaged noise-equivalent power lower than 3 10 W/Hz. The interaction between the kilo-pixel array and cosmic rays is studied, with an expected dead time lower than 0.6% when operated in an L2 or a similar far-Earth orbit.

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Section: Discussionmentioning

confidence: 99%

Ultrasensitive Kilo-Pixel Imaging Array of Photon Noise-Limited Kinetic Inductance Detectors Over an Octave of Bandwidth for THz Astronomy

et al. 2018

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“…To tackle the challenges and further explore waveguide fed antenna solutions, several antenna designs with different fabrication processes have been developed to operate above 100 GHz. Silicon-based micromachining technologies have enabled 3-D antennas, e.g., corrugated horn, silicon lens, for operations up to 1.9 THz with the maximum aperture efficiency of 85% [8]- [10]. Authors in [11] propose a substrate integrated waveguide fed slot antenna array that can be fabricated using low-temperature co-fired ceramic (LTCC) technology.…”

Section: Introductionmentioning

confidence: 99%

A D-Band 3D-Printed Antenna

Gao

Fusco

et al. 2020

IEEE Trans. THz Sci. Technol.

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“…A promising alternative fabrication technology is siliconmicromachining using deep reactive-ion-etching (DRIE), which allows for batch fabrication, has superior (micrometer) precision, enables high-complexity geometries, as well as nanometer surface roughness and thus better insertion loss. Impressive device performance has been achieved by micromachining in various sub-THz frequency bands, for instance, for waveguides [3]- [5], couplers [6], low-loss filters [7], [8], OMTs [9], antennas [10], [11], and MEMSreconfigurable devices such as waveguide switches [12] and phase shifters [13].…”

Section: Introductionmentioning

confidence: 99%

Micromachined Silicon-Core Substrate-Integrated Waveguides at 220–330 GHz

Krivovitca

Shah

Glubokov

et al. 2020

IEEE Trans. Microwave Theory Techn.

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In this article, we present a new technology platform for creating compact and loss-efficient wafer-scale integrated micromachined substrate-integrated waveguides with silicon-core (Si-SIWs) for the 230-330-GHz frequency range. The silicon dielectric core enables highly integrated sub-millimeter-wave systems, since it allows for downscaling the waveguide's cross section by a factor of 11.6, and the volume of components by a factor of 39.3, as compared to an air-filled waveguide. Moreover, geometrical control during fabrication of this type of waveguides is significantly better as compared to micromachined hollow waveguides. The measured waveguide's insertion loss (IL) is 0.43 dB/mm at 330 GHz (0.14 dB/λ g , normalized to the guided wavelength). A low-loss ultrawideband coplanar-waveguide (CPW) transition is implemented to enable direct measurements of devices and circuits in this waveguide platform, and this is also the very first CPW-to-SIW transition in this frequency range. The measured IL of the transition is better than 0.5 dB (average 0.43 dB above 250 GHz), which is lower than for previously reported CPW-to-SIW transitions even at 3 times lower frequencies; the return loss is better than 14 dB for 75% of the band. As devices examples implemented in this platform, a filter and H-plane waveguide bends are shown. The waveguides and the devices are manufactured by deep-silicon etching using a cost-efficient two-mask micromachining process.

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Development of Silicon Micromachined Microlens Antennas at 1.9 THz

Cited by 35 publications

References 18 publications

Ultrasensitive Kilo-Pixel Imaging Array of Photon Noise-Limited Kinetic Inductance Detectors Over an Octave of Bandwidth for THz Astronomy

Ultrasensitive Kilo-Pixel Imaging Array of Photon Noise-Limited Kinetic Inductance Detectors Over an Octave of Bandwidth for THz Astronomy

A D-Band 3D-Printed Antenna

Micromachined Silicon-Core Substrate-Integrated Waveguides at 220–330 GHz

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