Development of RF-MEMS switch on PCB substrates with polyimide planarization

Ghodsian, B.; Jung, Chang Won; Cetiner, Bedri A.; Flaviis, F. De

doi:10.1109/jsen.2005.854148

Cited by 14 publications

(8 citation statements)

References 19 publications

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“…Diversity of polyimides chemical structure and the acceptance of a wide variety of chemical additives allow tailoring the physical characteristics of these materials to meet the requirements of many different applications. Since they can be modified to be conductive or insulating, magnetic, or nonmagnetic, piezoelectric or nonpiezoelectric, photosensitive or nonphotosensitive (Wilson and Atkinson, ), polyimides can be used in many types of micro electro mechanical systems (MEMS), such as in fingerprint sensors for biometrics (Han and Koshimoto, ), ultrasound scanners (Zara and Smith, ) and in radio frequency micro electro mechanical system (RF MEMS) switches (Ghodsian et al, ). Polyimide film in a device is generally interfaced to another polyimide film, as well as a number of different inorganic materials, such as silicon (Tan et al, ), aluminum (Lin et al, ; Park et al, ), copper (Su et al, ; Xu et al, ), chromium (Cordill et al, ; Noh et al, ) and tungsten (Yao et al, ).…”

Section: Introductionmentioning

confidence: 99%

Statistical analysis on morphology development of some semialicyclic polyimides using atomic force microscopy

Stoica¹,

Barzic²,

Hulubei³

et al. 2013

Microscopy Res & Technique

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The morphological features and surface texture parameters of some polyimide films prepared from a flexible and alicyclic dianhydride, in combination with five aromatic diamines, were evaluated by atomic force microscopy (AFM) in order to determine their applicability in electronics. By means of the surface roughness, shape of the surface height distribution, and angular and radial texture, a precise description of the actual surface topographies at the interface with other materials was made. The polyimide structures led to the development of different surface morphologies (from granular to porous and from bumpy to spiky). The relief diversity was described by the entropy of morphology, which had a similar trend with the root mean square roughness, which presents low values, i.e. 0.5-1.8 nm. Three-dimensional AFM images and the corresponding angular spectra, together with texture aspect ratio and texture direction index (close to 1), indicate that no predominant orientation exists on the investigated surfaces. The redundancy in the morphology was associated with the concept of fractals, the maximum redundancy being achieved for the polyimide with the most complex polymer chain conformation. These results provide useful insights in selecting the polyimide structure, which has the optimal morphology, roughness, orientation, bearing properties, or self-similarity for microelectronic applications such as: substrate for display backplanes, planar technology, microelectronic packaging, etc.

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Section: Introductionmentioning

confidence: 99%

Statistical analysis on morphology development of some semialicyclic polyimides using atomic force microscopy

Stoica¹,

Barzic²,

Hulubei³

et al. 2013

Microscopy Res & Technique

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“…3). Approaches to reduce the surface roughness of the microwave laminates include polishing and planarization and compressive molding planarization (Ghodsian et al 2005) which needs polyamide coating. We polished the laminate directly without the polyamide film.…”

Section: Polishing Of Copper On Laminatementioning

confidence: 99%

A low cost approach for the fabrication of microwave phase shifter on laminates

Goel

Vinoy

2011

Microsyst Technol

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This paper presents a simple and low cost fabrication approach using extended printed circuit board processing techniques for an electrostatically actuated phase shifter on a common microwave laminate. This approach uses 15 lm thin copper foils for realizing the bridge structures as well as for a spacer. A polymeric thin film deposited by spin coating and patterned using lithographic process is used as a dielectric layer to improve the reliability of the device. The prototype of the phase shifter for X-band operation is fabricated and tested for electrical and electromechanical performance parameters. The realized devices have a figure of merit of 70°/dB for a maximum applied bias potential of 85 V. Since these phase shifters can be conveniently fabricated directly on microwave substrates used for feed distribution networks of phased arrays, the overall addition in cost, dimensions and processing for including these phase shifters in these arrays is minimal.

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“…While many MEMS devices have been built using semiconductor manufacturing techniques, limited work has been done to demonstrate fabrication of MEMS using PSM processes such as PCB and packaging. Early work by Bachman, Li, Chason, Ramadoss, Liu, DeFlaviis and others has shown that useful devices can indeed be produced using these technologies (Chang et al, 2005(Chang et al, , 2002(Chang et al, , 2003Palasagaram and Ramadoss, 2006;Ramadoss et al, 2003;Wang et al, 2003;Chason et al, 2006;Ghodsian et al, 2005;Bachman and Li, 2008;Cetiner et al, 2003), though until recently the technology was suitable primarily for producing larger structures, so-called "meso-MEMS", or simple devices. Current PSM technologies finally allow for truly "micro" devices of significant sophistication, especially if semiconductor-style techniques are combined with PSM techniques.…”

Section: Introductionmentioning

confidence: 99%

Integrated MEMS in package

Bachman

Li²

2012

Circuit World

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Purpose -The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications. Design/methodology/approach -A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom. Findings -Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre-packaged, and at low cost.Research limitations/implications -Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products. Originality/value -The paper presents examples of basic packaging fabrication processes for producing 3-D structures and free-standing structures, and a new MEMS manufacturing paradigm to build micro-electromechanical (MEMS) for biomedical, optical, and RF communication applications.

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Development of RF-MEMS switch on PCB substrates with polyimide planarization

Cited by 14 publications

References 19 publications

Statistical analysis on morphology development of some semialicyclic polyimides using atomic force microscopy

Statistical analysis on morphology development of some semialicyclic polyimides using atomic force microscopy

A low cost approach for the fabrication of microwave phase shifter on laminates

Integrated MEMS in package

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