Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Zhou, Tianshen; Ma, Shuying; Li, Ming; Hang, Tao

doi:10.3390/s20154077

Cited by 10 publications

(3 citation statements)

References 25 publications

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“…Once the sensors are finished, they undergo a variety of reliability tests [3]. Of great importance from an adhesive point of view are those that can cause aging or degradation of the adhesive.…”

Section: B Image Sensor Assembly and Reliability Testingmentioning

confidence: 99%

Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2024

IMAPSource Proceedings

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The trend towards autonomous driving demands continuously increasing safety requirements and hence reliable components such as CMOS image sensors or communication devices. To provide such components, manufactures are facing ever greater challenges as the sensor packages need to be airtight-sealed over its whole lifetime. Typical defects that can be observed when using conventional lid attach materials for closed cavity packages in tests at automotive level (e.g., according to AEC Q100) are pop-up effects and delamination. To avoid these defects and to meet the increasing reliability requirements of the semiconductor industry, DELO Industrial Adhesives has developed special adhesives that not only ensure reliable bonding while keeping narrow and high bondlines, but also improve process stability. The required adhesive properties were defined by an FE analysis model. To test suitability of the new developments, dummy image sensor packages were built up, which passed through the testing of the bearing, according to AEC Q 100 standard. Finally, the tightness of the bondline was checked via microscope and other methods. Features such as light/heat B-stage or light fixation help to keep the attached lid in place during heat curing and other subsequent steps like temperature cycling, humidity storage or reflow.

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Section: B Image Sensor Assembly and Reliability Testingmentioning

confidence: 99%

Adhesive Solutions for Closed Cavity Packaging

Schirmer,

Ringelstetter

2024

IMAPSource Proceedings

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“…This technology extends beyond human vision and drives innovation and advances in sophisticated machine vision, automotive image sensors, biomedical imaging, environmental and security monitoring, and military and defense applications. [1][2][3][4][5] Specifically, distinguishing or extracting visible (VIS, wavelength (𝜆) = 400-750 nm) and near-infrared (NIR, 𝜆 = 750-1400 nm) information in real-time is critical to enhancing the visibility and accuracy of automatic vision systems to achieve facile object recognition, hazard identification, and situation judgment. [6,7] Currently, the predominant approach for achieving wavelength selectivity employs broadband Si photodiodes coupled with optical cutoff filters (CFs).…”

Section: Introductionmentioning

confidence: 99%

Monolithic Perovskite–Silicon Dual‐Band Photodetector for Efficient Spectral Light Discrimination

Kim,

Seo,

Ahn

et al. 2024

Advanced Science

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Selective spectral discrimination of visible and near‐infrared light, which accurately distinguishes different light wavelengths, holds considerable promise in various fields, such as automobiles, defense, and environmental monitoring. However, conventional imaging technologies suffer from various issues, including insufficient spatial optimization, low definition, and optical loss. Herein, a groundbreaking advancement is demonstrated in the form of a dual‐band photodiode with distinct near‐infrared‐ and visible‐light discrimination obtained via simple voltage control. The approach involves the monolithic stacking integration of methylammonium lead iodide (MAPbI3) and Si semiconductors, resulting in a p‐Si/n‐phenyl‐C61‐butyric acid methyl ester/i‐MAPbI3/p‐spiro‐MeOTAD (PNIP) device. Remarkably, the PNIP configuration can independently detect the visible and near‐infrared regions without traditional optical filters under a voltage range of 3 to −3 V. In addition, an imaging system for a prototype autonomous vehicle confirms the capability of the device to separate visible and near‐infrared light via an electrical bias and practicality of this mechanism. Therefore, this study pushes the boundaries of image sensor development and sets the stage for fabricating compact and power‐efficient photonic devices with superior performance and diverse functionality.

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“…Because the range of existing technologies is so broad, there is no perfect solution in terms of key evaluating indicators such as low cost, process risk, reliability performance, degree of miniaturization, and compatibility with various microelectromechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) technologies on a wafer [ 17 , 18 ]. We aimed to create a reliable high-performance WLP for SAW device processing flow in this study, with a particular focus on keeping the low cost and post-wafer-level process flow as short as possible to reduce the chance of process failure.…”

Section: Introductionmentioning

confidence: 99%

Development of a Reliable High-Performance WLP for a SAW Device

Chen

2022

Sensors

Self Cite

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In this paper, we present wafer-level packaging technology for surface acoustic wave (SAW) filters with higher long-term reliability and better electrical performance. This article focuses on the package structure, fabrication processes, and reliability for the SAW filter wafer-level package (WLP). The key processes, including cavity wall (CW) dam formation through non-photosensitive film vias development using a laser drilling process, a redistribution layer (RDL), and ball-grid array formation are developed. In addition, a numerical study based on the finite element model has been conducted to analyze the stress distribution of Cu RDL traces. In addition, the CW dam and the roof layer are covered with polymer, which solves the delamination problem between the CW dam and the substrate. Meanwhile, after practical verification, the SAW filter WLP was resistant to encapsulating pressure using a high elastic modulus capping material, which solved the collapse problem. Additionally, a comparison of the RF filter package’s electrical performance following the preconditional level 3 and unbiased highly accelerated stress test revealed no differences in insertion attenuation across the passband (<0.2 dB, standard value: 1 dB). The final packages passed the reliability tests in the field of consumer electronics.

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Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Cited by 10 publications

References 25 publications

Adhesive Solutions for Closed Cavity Packaging

Adhesive Solutions for Closed Cavity Packaging

Monolithic Perovskite–Silicon Dual‐Band Photodetector for Efficient Spectral Light Discrimination

Development of a Reliable High-Performance WLP for a SAW Device

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