2015
DOI: 10.1016/j.jallcom.2014.12.209
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Development of plastic elongation in nanocrystalline and amorphous Ni–W dual phase alloys by brushing technique

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Cited by 5 publications
(3 citation statements)
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“…From these results, it was confirmed that the deposition of Ni-W on a copper reversing mold is effective for obtaining a film of about 20 µm thickness without any deterioration of its strength and ductility. (8)…”
Section: Double Electroplating In Liga Processmentioning
confidence: 99%
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“…From these results, it was confirmed that the deposition of Ni-W on a copper reversing mold is effective for obtaining a film of about 20 µm thickness without any deterioration of its strength and ductility. (8)…”
Section: Double Electroplating In Liga Processmentioning
confidence: 99%
“…was applied, which can suppress the generation of voids and pits due to hydrogen bubbles. (4,8) The plating time was adjusted so that the film thickness was approximately 100 µm. The electrodeposited Ni-W microgears were immersed in HNO 3 solution to separate them from the brass substrate and the copper reversing mold.…”
Section: Second Electroforming (Replication) Processmentioning
confidence: 99%
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