Development of novel temperature-stable Al2O3–TiO2-based dielectric ceramics featuring superior thermal conductivity for LTCC applications

Shigeno, Koichi; Li, Moyuan; Fujimori, Hirotaka

doi:10.1016/j.jeurceramsoc.2020.08.072

Cited by 22 publications

(4 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Low-temperature cofired ceramics (LTCC) technology has the characteristics of low sintering temperature, miniaturization, lightweight, excellent thermal performance, and multilayer printed circuit boards. [1][2][3][4][5] It can provide high/low dielectric constant, low dielectric loss for a single and multilayer packaging system, [6,7] and provide multifunction characteristics through integration and interconnections. Currently, LTCC technology is considered as one of the optimal methods to achieve multilayer ceramic packaging.…”

Section: Introductionmentioning

confidence: 99%

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Xiao,

Zhang,

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

Low‐temperature co‐fired ceramic(LTCC) materials are a promising material for heat dissipation substrates due to their excellent thermal conductivity and thermal expansion coefficient similar to that of silicon. However, the difficulties in surface metallization techniques limit its application. This work uses Bi‐B‐Si‐Zn‐Al glass/ceramic composite as the substrate and Bi‐B‐Si‐Zn‐Al glass powder as the inorganic binder for silver pastes. The silver thick film with a glass content of 3 wt% is sintered at 800 °C for 30 min, and the samples have excellent electrical conductivity (surface square resistance of 0.29 mΩ/□) and mechanical properties (interface bonding force of 17.56 MPa). In addition, the introduction of CuO into the glass phase can inhibit the silver diffusion phenomenon during the sintering process and improve the conductive performance of the material. The results are beneficial for the preparation and application stability of LTCC devices.This article is protected by copyright. All rights reserved.

show abstract

Section: Introductionmentioning

confidence: 99%

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Xiao,

Zhang,

et al. 2024

Adv Eng Mater

View full text Add to dashboard Cite

show abstract

“…The high rates of productivity in the wireless communication industries, which are increasingly inclined toward miniaturization and integration, are the main causes of the scientific and industrial community’s recent preoccupation with LTCC technology [ 10 ]. However, metal electrodes must be chemically compatible with the LTCC composites, and their sintering temperature must be lower than the melting points of highly conductive electrodes such as Ag or Au [ 11 , 12 , 13 , 14 , 15 , 16 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

et al. 2023

View full text Add to dashboard Cite

Various glass-ceramics are widely used or considered for use as components of microelectronic materials due to their promising properties. In this study, borosilicate glass was prepared using the powder metallurgical route and then mixed with different amounts of Al2O3 and ZrO2 filler materials. Glass-ceramics are produced by high-energy ball milling and conventional sintering process under Ar or air. In this study, the effects of different filler materials and different atmospheres on the microstructural, thermal and dielectric properties were investigated. The data showed that ZrO2 filler material led to better results than Al2O3 under identical working conditions and similar composite structures. ZrO2 filler material significantly enhanced the densification process of glass-ceramics (100% relative density) and led to a thermal conductivity of 2.904 W/K.m, a dielectric constant of 3.97 (at 5 MHz) and a dielectric loss of 0.0340 (at 5 MHz) for the glass with 30 wt.% ZrO2 sample. This paper suggests that prepared borosilicate glass-ceramics have strong sinterability, high thermal conductivity, and low dielectric constants, making them promising candidates for microelectronic devices.

show abstract

“…The significant characteristics of LTCC are excellent dielectric properties, high thermal conductivity, cost-effectiveness, and sintering temperature below the melting points of metal electrodes (Ag or Cu or Au). Thus, sintering below 950 • C makes it unique for miniaturized and integrated electronic devices [1,3,4,7,8,11,[19][20][21][22]. Besides, glass content embedded in a ceramic system provides multifunctional characteristics, such as high strength and high durability [10,14,23].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Arıbuğa

Akkasoglu²,

Çiçek

et al. 2022

Materials

View full text Add to dashboard Cite

With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.

show abstract

Development of novel temperature-stable Al2O3–TiO2-based dielectric ceramics featuring superior thermal conductivity for LTCC applications

Cited by 22 publications

References 34 publications

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Contact Info

Product

Resources

About