Development of novel high Tg polyimide-based composites. Part I: RTM processing properties

Fernberg, Patrik; Gong, Guan; Mannberg, Peter; Tsampas, Spyros

doi:10.1177/0021998317705705

Cited by 11 publications

(10 citation statements)

References 23 publications

(41 reference statements)

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“…After cured at 343 °C for 8 h, the T g of the formulation based on a-BTDA and 3,3′-diaminobenzophenone (3,3′-DABP) exceeded 400 °C. Furthermore, in order to improve the heat resistance of PETI, Fernberg et al [ 30 ] introduced ethynyl moiety into the main chain of phenylethynyl end-capped polyimide resins that are amenable to RTM, by using ethynyl bis-phthalic anhydride (EBPA). During cure at 370 °C and post-cure at a temperature of over 400 °C, the T g of materials could reach 400 °C.…”

Section: Introductionmentioning

confidence: 99%

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Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure–Melt Stability Relationship

Hong

Yuan

et al. 2021

Polymers

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Phenylethynyl-terminated aromatic polyimides meet requirements of resin transfer molding (RTM) and exhibits high glass transition temperature (Tg) were prepared. Moreover, the relationship between the polyimide backbones structure and their melting stability was investigated. The phenylethynyl-terminated polyimides were based on 4,4’-(hexafluorosiopropylidene)-diphthalic anhydride (6FDA) and different diamines of 3,4’-oxydianiline (3,4’-ODA), m-phenylenediamine (m-PDA) and 2,2’-bis(trifluoromethyl)benzidine (TFDB) were prepared. These oligoimides exhibit excellent melting flowability with wide processing temperature window and low minimum melt viscosities (< 1 Pa·s). Two of the oligoimides display good melting stability at 280–290 °C, which meet the requirements of resin transfer molding (RTM) process. After thermally cured, all resins show high glass transition temperatures (Tgs, 363–391 °C) and good tensile strength (51–66 MPa). The cure kinetics studied by the differential scanning calorimetry (DSC), 13C nuclear magnetic resonance (13C NMR) characterization and density functional theory (DFT) definitely confirmed that the electron-withdrawing ability of oligoimide backbone can tremendously affect the curing reactivity of terminated phenylethynyl groups. The replacement of 3,4’-ODA units by m-PDA or TFDB units increase the electron-withdrawing ability of the backbone, which increase the curing rate of terminated phenylethynyl groups at processing temperatures, hence results in the worse melting stability.

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Section: Introductionmentioning

confidence: 99%

“…However, to our best knowledge, there are little reports on its causes and effect factors. Usually, the viscosity of resins increases over time under isothermal conditions, which was considered to be induced by the curing of phenylethynyl groups [ 28 , 30 ]. Scola et al [ 20 ].…”

Section: Introductionmentioning

confidence: 99%

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure–Melt Stability Relationship

Hong

Yuan

et al. 2021

Polymers

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“…T g is the temperature at which the macromolecular components of the polymer begin to move. 18 When the temperature is below T g , the molecular chains of the polymeric materials are frozen in a glass state allowing the polymers to have numerous practical uses. By contrast, the glass state morphology of polymeric materials will be converted to a rubbery state when the temperature is above T g .…”

Section: Glass Transition Behaviormentioning

confidence: 99%

Friction and wear behavior of polyimide matrix composites filled with nanographite

Wan

Yao

et al. 2021

J of Applied Polymer Sci

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In this study, nanographite (NG), as a lubricant additive, and polyimide (PI) were used to fabricate NG/PI composites via a hot compression molding process. The tribological properties of the NG/PI composites with different NG mass contents (0-10 wt%) were tested using a reciprocating ball-on-disc contact tribometer matched with a GCr15 rubbing pair. The thermal stability, surface hardness, and compression strength of the composites were discussed. The results revealed that a small quantity of nanofillers greatly reduced the friction coefficient and increased the wear resistance of the NG/PI composites. Despite a minor decrease in mechanical performance, the composite with 5 wt% of NG filler exhibited improved tribological properties; it showed a 55.63% reduction in the friction coefficient and a reduction of 97.39% in the wear rate compared with neat PI. Moreover, an increase in the glass transition temperature (T g ) of the NG/PI composites indicated the enhancement of their thermal stability and wear resistance. Scanning electron microscopy (SEM) analyses showed that the main wear mechanism of the composites was fatigue wear. These findings suggest that the 5 wt% NG/PI composite could be a significant contribution to the field of tribological engineering plastics.

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“…Additionally, the introduction of a second crosslinkable segment in the main chain of thermosetting polyimide, besides the PEPA crosslinking agent, has also been studied in order to further improve the heat resistance of polyimide resins and maintain simultaneously the melt processability of its oligoimides. Fernberg et al developed a 6FDA-based phenylethynyl-terminated polyimide resin MHT-R suitable for RTM by introducing ethynyl bis-phthalic anhydride (EBPA) into the main chain [ 17 , 18 ]. They found that MHT-R resin exhibited relatively low melt viscosity of 0.2–2.0 Pa·s between 250–320 °C, which is suitable for fabricating high-quality carbon fiber-reinforced composites by RTM.…”

Section: Introductionmentioning

confidence: 99%

High Thermally Stable and Melt Processable Polyimide Resins Based on Phenylethynyl-Terminated Oligoimides Containing Siloxane Structure

Liu

Lan

et al. 2020

Materials

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A series of 4-phenylethnylphthalic anhydride (PEPA)-terminated oligoimides were prepared by co-oligomerizing isomeric dianhydrides, i.e., 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), 2,3,3′,4′-benzophenonetetracarboxylic dianhydride (a-BTDA) or 2,3,3′,4′-diphenylethertetracarboxylic dianhydride (a-ODPA), with diamines mixture of bis(4-aminophenoxy)dimethyl silane (APDS) and 2,2′-bis(trifluoromethyl) benzidine (TFDB). The effects of siloxane content and dianhydride structure on the rheological properties of these oligoimides and thermal stability of the corresponding cured polyimide resins were investigated. The results indicated that the introduction of the siloxane structure improved the melt processability of the oligoimides, while the thermal stability of the cured polyimide resins reduced. The oligoimide derived from a-ODPA revealed better melt processability and melt stability due to the existence of a flexible dianhydride structure. The oligoimide PIS-O10 derived from a-ODPA gave the lowest minimum melt viscosity of 0.09 Pa·s at 333 °C and showed the excellent melt stability at 260 °C for 2 h with the melt viscosity in the range of 0.69–1.63 Pa·s. It is also noted that the thermal stability of these resins can be further enhanced by postcuring at 400–450 °C, which is attributed to the almost complete chemical crosslinking of the phenyethynyl combined with oxidative crosslinking of siloxane. The PIS-T10 and PIS-O10 resins that were based on a-BTDA and a-ODPA, respectively, even showed a glass transition temperature over 550 °C after postcuring at 450 °C for 1 h.

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Development of novel high Tg polyimide-based composites. Part I: RTM processing properties

Cited by 11 publications

References 23 publications

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure–Melt Stability Relationship

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure–Melt Stability Relationship

Friction and wear behavior of polyimide matrix composites filled with nanographite

High Thermally Stable and Melt Processable Polyimide Resins Based on Phenylethynyl-Terminated Oligoimides Containing Siloxane Structure

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