2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.83
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Development of Non-TSV Interposer (NTI) for High Electrical Performance Package

Fang-Yu Liang
1
,
Hung-Hsien Chang
2
,
Wen-Tsung Tseng
3
et al.
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