2005 7th Electronic Packaging Technology Conference
DOI: 10.1109/eptc.2005.1614420
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Development of No-flow Underfill Materials and Processes for Pb-free Flip Chip Applications

A. Prabhakumar
1
,
Daniel H. Buckley
2
,
Paul Gillespie
3
et al.

Abstract: Due to pending legislation worldwide, the semiconductor packaging industry is switching over to Pb-

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