Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding

Jung, Yang-Gyoo; Ryu, Dongsu; Gim, MinHo; Kim, Choonghoe; Song, YunSeok; Kim, Jin‐Young; Yoon, Juhoon; Lee, Choonheung

doi:10.1109/ectc.2016.76

Cited by 28 publications

(10 citation statements)

References 10 publications

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“…Pressure-assisted sintering and pressure-less sintering are based on heating approaches from hot plates or atmospheres. Furthermore, there have been some novel sintering approaches, e.g., electric-current-assisted sintering (ECAS) [61] , selective laser sintering [62] and microwave sintering [63] , to improve the efficiency and the physical properties of sintered silver attachment.…”

Section: Other Novel Sintering Techniquesmentioning

confidence: 99%

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Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Yan

Liang

Mei

et al. 2020

Chin. J. Electr. Eng.

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Silver sintering is receiving increasing attention due to its novel die-attach technique for high-temperature power electronics. Excellent thermal conductivity, high melting point/remelting temperature and low-temperature sintering behaviors of the silver sintered attachment meet the requirements of high-temperature applications for power devices, specifically SiC devices. The merits and demerits of the existing pressure-assisted sintering and pressure-less sintering techniques using nano-scale, micro-scale and micro-nano-scale hybrid silver sintered materials are separately presented. The emerging rapid sintering approaches, such as the electric-assisted approach, are briefly introduced and the technical outlook is provided. In addition, the study highlights the importance of creating a brief resource guide on using the correct sintering methods.

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Section: Other Novel Sintering Techniquesmentioning

confidence: 99%

“…Appropriate pre-heat temperature, time, and pressure are required. In addition, novel microwave sintering and selective laser sintering are utilized to sinter metals/metal matrix composites with ceramics [62][63] . Fig.…”

Section: Other Novel Sintering Techniquesmentioning

confidence: 99%

Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Yan

Liang

Mei

et al. 2020

Chin. J. Electr. Eng.

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“…Therefore, the temperature of devices or packages is high compared with that of a substrate. That is, we can obtain the vertical temperature distributions during the LAB bonding process 1) .…”

Section: Laser-assisted Bonding (Lab) and Its Bonding Materialsmentioning

confidence: 99%

“…This paper introduces laser-assisted bonding (LAB) and its bonding materials as one of technical alternatives to solving these problems. The LAB features vertical thermal gradients between the device and the substrate during the bonding process, effectively reducing the warpage generated by conventional bonding process 1) . Its short process time provides a good solution to ultra-fine pitch joining as well as ensuring mass production.…”

Section: Introductionmentioning

confidence: 99%

Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications

Choi

Joo

Jang

et al. 2020

Journal of Welding and Joining

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Laser-Assisted Bonding (LAB) and its bonding materials help to find solutions to productivity, reduced warpage during fabricating modules, and fine-pitch bonding. Fluxing and hybrid underfill materials are developed to simplify the bonding process by eliminating the conventional underfill and cleaning process. We introduce two applications exhibiting the advantages of the LAB with two materials. Fluxing underfill was applied to bond a daisy chain chip with the minimum interconnection pitch of 30㎛ within 2 seconds. Hybrid underfill was used to fabricate a silicon back-contact solar module with reduced warpage, compared with the module fabricated through the conventional reflow process.

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“…Laser‐assisted bonding (LAB) is an advanced flip chip and surface mount bonding technology in which a homogenized laser beam is selectively applied to a chip or component in order to establish a metallurgical interconnection with a substrate (Figure A). LAB was first developed and reported by Amkor Technology to overcome the reliability and yield issues in the mass reflow process (owing to high warpage during device assembly) and the low throughput issues in the thermocompression bonding process (owing to the limited heating rate of the equipment) .…”

Section: Introductionmentioning

confidence: 99%

Collective laser‐assisted bonding process for 3D TSV integration with NCP

et al. 2019

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Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single‐tier LAB process for 3D through‐silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single‐tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu‐Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

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Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding

Cited by 28 publications

References 10 publications

Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Brief review of silver sinter-bonding processing for packaging high-temperature power devices

Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications

Collective laser‐assisted bonding process for 3D TSV integration with NCP

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