Development of nanocomposite lead-free electronic solders

Lee, A.; Subramanian, K. N.; Lee, Jong‐Gi

doi:10.1109/isapm.2005.1432089

Cited by 9 publications

(3 citation statements)

References 17 publications

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“…Current, the electronic industries are pushing towards higher performance device with emphasis also on miniaturization of the components. The addition of nanoreinforced material on the lead free solder has become an impending method in order to enhance the reliability and performance of the solder joint at micro-and nano-scales level (Lee et al, 2005). Guo (2017) introduce the effect of the reinforcement addition on the mechanical properties of the composite lead free solder with the experimental result indicating significant improvement on the reliability of the nanocomposite solder joint.…”

Section: Nomenclaturementioning

confidence: 99%

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Mukhtar¹,

Abas²,

Haslinda³

et al. 2019

JAFM

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The wetting formation and nanoparticles dispersion on adding nanoparticles to the lead free solder Sn-3.0Ag-0.5Cu (SAC305) is methodically investigated using Discrete Phase Model (DPM) simulation and applied on a 01005 capacitor component. Different types of nanoparticles, namely titanium dioxide (TiO2), nickle oxide (NiO) and Iron (III) oxide (Fe2O3) with varying weight percentages, 0.01wt%, 0.05wt% and 0.15wt% that is doped in SAC305 are used. The study of two-way interactions between multiphase volume of fluid (VOF) and discrete phase model (DPM) shows excellent capability in tracking the dispersed nanoparticles immersed in the wetted molten solder. In this study, real reflow profile temperature setup will be used to mimic the conventional reflow process. Based on the findings, the fillet height managed to achieve the minimum required height set by IPC standards. As the concentration of the nanoparticles doped in the molten solder increases, higher time is required for the wetting process. In general, the doped NiO nanoparticles at 0.05wt% has the lowest wetting time compared to other cases. The study of the instantaneous nanoparticles trajectory tracking was also conducted on a 3D model and 2D cross sectional view to identify the exact movement of the particles. Additionally, it was also observed that the velocity and pressure distribution increases as the weight percentage of the nanoparticles increases.

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Section: Nomenclaturementioning

confidence: 99%

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Mukhtar¹,

Abas²,

Haslinda³

et al. 2019

JAFM

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“…Inert, hybrid inorganic/organic, nano structured chemicals, were incorporated into low melting metallic materials, such as lead-free electronic solders were evaluated to achieve improved mechanical performance at elevated temperatures and service reliability of lead-free electronic solders. Organic derived nano reinforcements with appropriate functional groups to promote bonding with the metallic matrix efficiently pinned the grain boundary of solder alloys leading to the improvement in properties [13]. This technology can be easily implemented with the sol-gel route.…”

Section: B Electroless Platingmentioning

confidence: 99%

Lead-Free Solder Films Via Novel Solution Synthesis Routes

Aggarwal

Abothu

Raj

et al. 2007

IEEE Trans. Comp. Packag. Technol.

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We report two novel routes, sol-gel and electroless plating, for the synthesis of lead-free solders. Novel processes with these routes were developed and demonstrated for Sn-Ag-Cu, Sn-Ag systems to achieve thin bonding layers for assembly of fine pitch integrated circuits onto substrates. Sol-gel route can be used to accurately control the final alloy composition and incorporate additives leading to the designed thermomechanical properties. In this process, the inorganic polymer solutions were spin coated and then heat-treated in a reducing atmosphere to form thin films of lead-free solders. The presence of Ag and Cu enabled easy reduction of tin oxide to tin at 400 C that was not possible with Sn precursor. With the alternate solution reduction (electroless plating) approach, bonding layers can be deposited at almost room temperatures directly on organic substrates. With this approach, the deposition selectively occurs on the metal bonding pads, which eliminates the need for any lithography. Using this approach, electroless Sn-Ag films were demonstrated on organic laminates. These thin film synthesis routes can enable short interconnections that are critical for high density, high frequency, and embedded active component packaging.

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“…Nanoparticles can be introduced into solder by various methods in order to enhance mechanical properties [1][2][3][4][5][6][7]. However, in this investigation, the nanoparticles are mixed into the solder paste, and only incorporated into the solder during reflow soldering.…”

Section: Introductionmentioning

confidence: 99%

Nanoparticle synthesis and formation of composite solder for harsh environments

Ashayer

Cobley

Mokhtari

et al. 2008

2008 2nd Electronics Systemintegration Technology Conference

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The demand for electronics capable of operating at high ambient temperatures above 150°C is increasing in the oil/gas drilling and automotive industries in particular. These demands have accelerated the progress of materials development and processing technology. Nanoparticle enhanced solders have been reported to have superior creep and reliability properties compared to simple alloyed materials. The nanoparticles, typically added at 1-2 vol% concentrations into the solder serve to harden the solder, stabilize the microstructure and improve reliability in high temperature environments. The nanoparticles may be added to the solder before production of solder particles, or added as a separate ingredient of the solder paste. This paper explores the latter approach.

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Development of nanocomposite lead-free electronic solders

Cited by 9 publications

References 17 publications

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

Lead-Free Solder Films Via Novel Solution Synthesis Routes

Nanoparticle synthesis and formation of composite solder for harsh environments

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