Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Syst 1999
DOI: 10.1109/memsys.1999.746828
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Development of microconnector with automatic connecting/disconnecting mechanism

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Cited by 9 publications
(2 citation statements)
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“…We tried to optimize an appropriate R using several size R (5 to 200µm) by the same LNF contact which will be described in this paper. To fabricate this miniature contact, a MEMS technology is used because the existing pressing and injection molding method is not compatible with the high-density packaging required in the advanced IT market [3][4][5][6][7][8]. This research focuses on a fabrication of micro interposer by combining UV thick resist photolithography and Ni-Co fine electroforming technology.…”
Section: Fig 1: Ic Test Socket Applicationmentioning
confidence: 99%
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“…We tried to optimize an appropriate R using several size R (5 to 200µm) by the same LNF contact which will be described in this paper. To fabricate this miniature contact, a MEMS technology is used because the existing pressing and injection molding method is not compatible with the high-density packaging required in the advanced IT market [3][4][5][6][7][8]. This research focuses on a fabrication of micro interposer by combining UV thick resist photolithography and Ni-Co fine electroforming technology.…”
Section: Fig 1: Ic Test Socket Applicationmentioning
confidence: 99%
“…The transcript seat lamination is done to the top of the structure (7). Base structure removed from bright electroplates (8). Lastly, the structure is removed from the 1st electroplates (9).…”
Section: Fabrication Processmentioning
confidence: 99%