Development of Micro Heat Pipes Embedded in Laminate Substrates for Enhanced Thermal Management (TM) for Printed Wiring Boards (PWBs)

Jones, K. F.; Cao, Yingwen; Gao, Min

doi:10.21236/ada412953

Cited by 5 publications

(4 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In 2002, Jones et al 15 reported embedding micro heat pipes in laminate substrates to enhance thermal management. The microgroove wick structure of Jones' prototype was realized by stacking the polymeric layers of the PCB in a staggered lay-up, as shown schematically in Fig.…”

Section: Current State-of-the-art Of Integrated Heat Pipe Technolmentioning

confidence: 99%

See 1 more Smart Citation

Advances in integrated heat pipe technology for printed circuit boards

Wits

Riele

2010

40th International Conference on Environmental Systems

View full text Add to dashboard Cite

Designing thermal control systems for electronic products has become very challenging due to the continuous miniaturization and increasing performance demands. Two-phase cooling solutions, such as heat pipes or vapor chambers, are increasingly used as they offer higher thermal coefficients for heat transfer. Following a multidisciplinary and integrative design approach, new concepts for two-phase cooling solutions for printed circuit boards are explored. This paper shows that by integrating thermal design criteria early in the total design phase, a radical new way of thermal control can be achieved. A new design to integrate heat pipe technology with printed circuit board technology is presented. This concept improves the overall design flexibility of the electronic product significantly and thermal control is realized and manufactured in a more integrated way. Altogether this allows engineers to design a printed circuit board with full integration of thermal control functionality. Nomenclature

show abstract

Section: Current State-of-the-art Of Integrated Heat Pipe Technolmentioning

confidence: 99%

“…We also like to thank Pieter Nieboer for his excellent work 23 on solving many of the encountered challenges. Finally, we would like to acknowledge the quick reply of Prof. Jones and for sharing the details of their technical report 15 with us.…”

Section: Acknowledgmentsmentioning

confidence: 99%

Advances in integrated heat pipe technology for printed circuit boards

Wits

Riele

2010

40th International Conference on Environmental Systems

View full text Add to dashboard Cite

show abstract

“…Cao [3] presented a comprehensive review of miniature heat pipes and their operating limitations in 1993. In 2002 Jones [4] reported micro heat pipes embedded in laminate substrates, based on a wick structure of microgrooves realized by stacking dielectric layers in a staggered lay-up. In this case, heat pipe failure occurred around IOW due to delamination of the PCB.…”

Section: Introductionmentioning

confidence: 99%

Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology

Wits

Legtenberg

Mannak

et al. 2006

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium

View full text Add to dashboard Cite

A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB) has been developed, based on mainstream PCB fabrication processes. Hot spots on the PCB, caused by heat dissipating components, can be cooled with relatively small temperature gradients across the board. Experimental verification has shown successful heat pipe operation. The results show an equivalent thermal conductivity 11 times better compared to solid copper. The low thermal resistance values establish this concept as a promising thermal management solution for future electronic products.

show abstract

“…In 2002 Jones et al [28] reported embedding micro heat pipes in laminate substrates to enhance thermal management. In this section their presented prototype is compared to the manufactured integrated heat pipe of this study.…”

Section: Other Embedded Heat Pipesmentioning

confidence: 99%

Integrated cooling concepts for printed circuit boards

Wits¹

View full text Add to dashboard Cite

Development of Micro Heat Pipes Embedded in Laminate Substrates for Enhanced Thermal Management (TM) for Printed Wiring Boards (PWBs)

Cited by 5 publications

References 4 publications

Advances in integrated heat pipe technology for printed circuit boards

Advances in integrated heat pipe technology for printed circuit boards

Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology

Integrated cooling concepts for printed circuit boards

Contact Info

Product

Resources

About