Development of ID-blade slicer monitoring system for cutting 12-inch silicon ingot

Jiang, Zhongwei; Fujiwara, Shusuke; Chonan, Seiji; Kawashima, Kazuo

doi:10.3233/jae-2002-429

Cited by 6 publications

(7 citation statements)

References 2 publications

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“…The researches on the behavior of the ID saw blade have been carried out mainly on stress and vibration analysis [1,4], and manufacturing technology of ID saw blade [5,7]. S. Chonan et al (1993) analyzed the stress distribution in a working ID blade slicing a crystal ingot [1], and found that the initial tension had a significant effect on the natural frequencies of the blade, while the lateral deflection of the blade was much affected by the lateral reaction force from ingot [2].…”

Section: Inroductionmentioning

confidence: 99%

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Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process

Wei

Yuan

Huang

et al. 2006

MSF

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In this paper, the wear behavior of the ID (inner diameter) saw blade in the cutting process of silicon ingot was observed with SEM. Its wear mechanism was discussed and the relation between the blade wear and vibration, deflection was analyzed. The results show that the blade worn manners include flatted diamond, micro-fractured diamond, macro-fractured diamond, pulled-out hole, tortoise-fractured bond, and polished bond. In the abnormal working stage of a blade, however, the working surface of the blade is displayed mainly with pulled out diamond, flatted diamond, macro-fractured diamond grains. Abnormal initial tension condition will induce severe vibration and deflection, and so then lots of diamond grits fractured or pulled out too early.

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Section: Inroductionmentioning

confidence: 99%

“…Z.W. Jiang et al (2001Jiang et al ( /2002 proposed ID -blade slicer monitoring system to online measure the vibration states of ID saw blade and evaluate its performance [4]. For improving the performance of ID saw blades, F.Y.…”

Section: Inroductionmentioning

confidence: 99%

Wear Characteristics of ID Saw Blade in Silicon Ingot Slicing Process

Wei

Yuan

Huang

et al. 2006

MSF

View full text Add to dashboard Cite

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“…There are two main processing methods for hard and brittle material slicing: diameter sawing [ 1 , 2 , 3 ] and wire sawing [ 4 , 5 , 6 , 7 ]. The diameter sawing methods broadly include inner diameter sawing [ 8 , 9 , 10 ] and external diameter sawing [ 11 , 12 ]. Compared with wire sawing and external diameter sawing, inner diameter sawing technology has greater advantages in small batch production and wafer roundness control, and it is more suitable for the processing of ceramics with moderate or short lengths [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

Surface Quality Improvement for Ultrasonic-Assisted Inner Diameter Sawing with Six-Axis Force Sensors

Zhao

Wang

Jiang

et al. 2023

Sensors

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Ultrasonic-assisted inner diameter machining is a slicing method for hard and brittle materials. During this process, the sawing force is the main factor affecting the workpiece surface quality and tool life. Therefore, based on indentation fracture mechanics, a theoretical model of the cutting force of an ultrasound-assisted inner diameter saw is established in this paper for surface quality improvement. The cutting experiment was carried out with alumina ceramics (99%) as an exemplar of hard and brittle material. A six-axis force sensor was used to measure the sawing force in the experiment. The correctness of the theoretical model was verified by comparing the theoretical modeling with the actual cutting force, and the influence of machining parameters on the normal sawing force was evaluated. The experimental results showed that the ultrasonic-assisted cutting force model based on the six-axis force sensor proposed in this paper was more accurate. Compared with the regular tetrahedral abrasive model, the mean value and variance of the proposed model’s force prediction error were reduced by 5.08% and 2.56%. Furthermore, by using the proposed model, the sawing processing parameters could be updated to improve the slice surface quality from a roughness Sa value of 1.534 µm to 1.129 µm. The proposed model provides guidance for the selection of process parameters and can improve processing efficiency and quality in subsequent real-world production.

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“…Under normal circumstances, there are two main processing methods for ceramics slicing: diameter sawing technology [6][7][8] and wire sawing technology [9][10][11][12]. The diameter sawing technology is divided into inner diameter sawing technology [13][14][15] and external diameter sawing technology [16,17]. Compared with the other two processing methods, the inner diameter sawing technology has greater advantages in small batch production and wafer roundness control, and it is more suitable for the processing of ceramics with moderate or short lengths [18].…”

Section: Introductionmentioning

confidence: 99%