Development of high frequency coreless transformer using thick film polymer technology

Arshak, K.; AlMukhtar, Basil

doi:10.1016/s0026-2692(98)00098-6

Cited by 10 publications

(7 citation statements)

References 7 publications

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“…An advantage of multilayer over coplanar devices is that they can reach higher L-values, up to 500 µH [31]. The performances of multilayer and coplanar microtransformers are comparable, with coupling coefficients higher than 70%, according to the articles that reported this parameter for multilayer devices [24], [26], [28], [32]- [38]. The quality factors of multilayer microtransformers can be higher than 10, as stated by some authors [39]- [41].…”

Section: Multilayermentioning

confidence: 92%

“…Publications reporting the development of microtransformers for communications are about 34% of the works analyzed [6], [16]- [19], [21], [23], [28], [32], [34]- [39], [48], [49], [51], [52], [55], [60], [61], [63], [68], [74], [75], [82], [83], [95], [103], [107], [110], [121]- [123], [136]. This includes applications like UHF and VHF circuits and microwave monolithic integrated circuits.…”

Section: B Communicationsmentioning

confidence: 99%

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A Survey on Microtransformers

Nascimento

Telles

Joanni

et al. 2021

JICS

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The miniaturization of magnetic devices is a subject of enduring interest, since inductors and transformers of very small dimensions are constantly being required for integration into microchips and electrical circuit boards. The main objective of this survey is to supply a compilation of the published research on microtransformers, and to work as a support material, helping in the choice of the most appropriate technology and device configuration for a particular application. The text describes the historical development of microtransformers, the structures in which these devices might be assembled, the various proposed geometries, the fabrication processes, and the type of core used. A brief discussion of equivalent circuit modeling is presented. The current state of the technology in relation to commercial devices is then examined, pointing out some unsolved problems that warrant further studies.

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Section: Multilayermentioning

confidence: 92%

Section: B Communicationsmentioning

confidence: 99%

A Survey on Microtransformers

Nascimento

Telles

Joanni

et al. 2021

JICS

View full text Add to dashboard Cite

show abstract

“…Several on-chip micro-transformers have been fabricated on high resistive substrate or low-K dielectric films (Arshak and AlMukhtar, 1999;Wu et al, 2000;Yunas et al, 2009). The aim was to reduce the eddy currents in the substrate for a higher quality factor of the transformer.…”

Section: Introductionmentioning

confidence: 99%

A planar fractal micro-transformer with air core and hilbert curve

Zhu

Khan

et al. 2014

Microsyst Technol

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In this paper, a novel MEMS-based planar fractal transformer is presented. Space-filling property of Hilbert curve is exploited for the miniaturization of integrated transformers. Compared to traditional spiral transformer, the fractal Hilbert transformer requires only one metal layer and no interconnection vias or crossovers, thereby reducing micro-fabrication complexity, EMI interference and resistive loss in the cross-overs. The transformer is implemented in a low-cost MetalMUMPs standard process. The transformer is coreless and the silicon underneath the primary and secondary coils is removed to mitigate the parasitic capacitance. The dc resistance of the transformer is 0.78 Ω, and the primary inductance of 9.3 nH has been obtained at 30 MHz. The quality factor of the transformer at 60 MHz is 1.6 and the total area of the transformer is 0.27 mm 2. The obtained inductance density of 35 nH/mm 2 is better than other air core transformers thus far in the literature.

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“…Several techniques for fabricating planar transformer using standard CMOS RF IC technology have been developed, including using highly resistive substrate or thick low-K dielectrics film (Arshak 1999;Dalmia et al 2002;Wu et al 2000;Yoon et al 1999). In term of micromachining techniques, metal ground shield (Jiang et al 2002), thick metal traces (Yue and Wong 1998), thick oxide and suspended coil spiral over silicon trench (Ribas et al 2000;Jiang et al 2000) and out of plane coil structure (Jolic et al 2003) have been used to reduce the parasitic effects.…”

Section: Introductionmentioning

confidence: 99%

Surface micromachined on-chip transformer fabricated on glass substrate

2008

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On-chip micro-transformer on high resistive glass substrate has been developed. The transformer consists of stacked spiral coil with square interwinding coil structure which is fabricated using surface micromachining technique. The performance of the micro-transformer is illustrated through low and high frequency measurements. The characteristics of glass based transformer are compared with conventional Si-based micro-transformer. The results show that the RF performance of the glass-based transformer is improved compared to that of silicon-based transformer. The process fabrication of the device is simple, highlighting a good prospect for the future threedimensional RF-MEMS device application.

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Development of high frequency coreless transformer using thick film polymer technology

Cited by 10 publications

References 7 publications

A Survey on Microtransformers

A Survey on Microtransformers

A planar fractal micro-transformer with air core and hilbert curve

Surface micromachined on-chip transformer fabricated on glass substrate

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