2014 15th International Conference on Electronic Packaging Technology 2014
DOI: 10.1109/icept.2014.6918721
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Development of ferroelectric RAM (FRAM) for mass production

Abstract: we have developed ferroelectric capacitor fabrication technique and a new sensing amplifier circuit to realize lowvoltage and high-density FRAM. Improvement of IrO x top electrode near the ferroelectric interface successively lowers operation voltage. And our developed "Dual Reference Sensing Amplifier" enables to commercialize highly-reliable FRAM with memory density of 4Mb or larger. FRAM, Feroelectric, PZT, IrO, Dual SensingI.

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Cited by 2 publications
(2 citation statements)
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“…The ferroelectric materials of the two tested devices is lead Zirconatetitanate (PZT). Based on [11], we deduce that Fujitsu FRAM is built using 1T/1C structure, while the architecture of the Cypress semiconductor FRAM is probably 2T/2C.…”
Section: Ferroelectric Ram Technologymentioning
confidence: 99%
“…The ferroelectric materials of the two tested devices is lead Zirconatetitanate (PZT). Based on [11], we deduce that Fujitsu FRAM is built using 1T/1C structure, while the architecture of the Cypress semiconductor FRAM is probably 2T/2C.…”
Section: Ferroelectric Ram Technologymentioning
confidence: 99%
“…Ramtron International Corporation presented the first commercial FRAM in 1988 [8]. FRAM is an advanced non-volatile memory that marketed earlier than its counterparts like MRAM, PCRAM, ReRAM [9].…”
Section: Electronic Memory Typesmentioning
confidence: 99%