Development of extremely thin profile flip chip CSP using laser assisted bonding technology

Kim, ChoongHoe; Jung, Yang-Gyoo; Kim, MinHo; Yoon, Tae‐Ho; Song, YunSeok; Na, SeokHo; Park, DongJoo; Cho, ByoungWoo; Kang, DaeByoung; Lim, KwangMo; Khim, JinYoung

doi:10.1109/icsj.2017.8240085

Cited by 11 publications

(2 citation statements)

References 3 publications

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“…LAB is a semiconductor packaging process in which a laser beam is selectively applied to a target flip-chip die and/or surface-mount component for less than a couple of seconds. [15][16][17][18][19][20] The interaction between the laser beam and the target device increases its temperature, thus allowing it to be metallurgically bonded to a substrate, interposer, or another die. The LAB system (Fig.…”

Section: Laser-assisted Bondingmentioning

confidence: 99%

Characterization of laser beams: theory and application in laser-assisted bonding process

Braganca

Kim

2021

Opt. Eng.

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The International Organization for Standardization (ISO), in collaboration with the academic community, has developed and published a comprehensive system of standards for the characterization of optical components and laser beams. Our study offers a pedagogical introduction to the theory and application of laser beam characterization in accordance with ISO 13694:2018 and ISO 11145:2018. The characterizing parameters of each ISO standard are presented, defined mathematically, and explained in detail through the use of a minimum working example. A laser beam applied to an actual industrial process [laser-assisted bonding (LAB) process in the semiconductor packaging industry] is thoroughly analyzed to help the reader understand and interpret the characterizing results. Background noise correction and unit conversion methods are also discussed. We target researchers new to the field of laser beam analysis who want the acquire background knowledge, as well as more experienced researchers who want to implement their own laser beam analysis software and propose new definitions for their specific application. Although our study deals with only two ISO standards, the methods covered in our study can be easily applied to other norms that fit the reader's application. Our study should not be treated as a full review of the LAB process nor of the beam profiling instruments and measurement principles. These are only mentioned to enhance the reader's learning experience.

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Section: Laser-assisted Bondingmentioning

confidence: 99%

Characterization of laser beams: theory and application in laser-assisted bonding process

Braganca

Kim

2021

Opt. Eng.

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“…Laser‐assisted bonding (LAB) is an advanced flip chip and surface mount bonding technology in which a homogenized laser beam is selectively applied to a chip or component in order to establish a metallurgical interconnection with a substrate (Figure A). LAB was first developed and reported by Amkor Technology to overcome the reliability and yield issues in the mass reflow process (owing to high warpage during device assembly) and the low throughput issues in the thermocompression bonding process (owing to the limited heating rate of the equipment) .…”

Section: Introductionmentioning

confidence: 99%

Collective laser‐assisted bonding process for 3D TSV integration with NCP

et al. 2019

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Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single‐tier LAB process for 3D through‐silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single‐tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu‐Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

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Advanced Flip Chip Packaging

Leong¹,

Huang²

2023

Springer Series in Reliability Engineering

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Development of extremely thin profile flip chip CSP using laser assisted bonding technology

Cited by 11 publications

References 3 publications

Characterization of laser beams: theory and application in laser-assisted bonding process

Characterization of laser beams: theory and application in laser-assisted bonding process

Collective laser‐assisted bonding process for 3D TSV integration with NCP

Advanced Flip Chip Packaging

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