2008
DOI: 10.1016/j.susc.2008.03.010
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Development of etch hillocks on different Si(hkl) planes in silicon anisotropic etching

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Cited by 21 publications
(15 citation statements)
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“…More careful examination of the features usually suggests otherwise [10,11]. Indeed, in fields of micromachining, texture features have been studied extensively [10][11][12][13][14]. However, relatively few conclusions have been transferred into the analysis of surface texture in silicon solar cell applications.…”
Section: Introductionmentioning
confidence: 99%
“…More careful examination of the features usually suggests otherwise [10,11]. Indeed, in fields of micromachining, texture features have been studied extensively [10][11][12][13][14]. However, relatively few conclusions have been transferred into the analysis of surface texture in silicon solar cell applications.…”
Section: Introductionmentioning
confidence: 99%
“…In those papers, modification of the surface tension is usually achieved by the addition of surfactants to the etchant. The subsequent analysis of the results has often focused mainly on the surfactants impact on the roughness of the etched surfaces produced [8,[12][13][14][15][16][17][18]. Zubel et al determined etch rates for KOH and TMAH solutions with and without additives [9-11, 17, 18].…”
Section: Introductionmentioning
confidence: 99%
“…As a result, the silicon post will form an octagonal cross section. 10,12 By combining both isotropic and anisotropic etching, we obtained an optimized equilateral octagonal shape. Figure 1 shows the fabrication process.…”
Section: Fabricationmentioning
confidence: 99%