Development of CO2 gas cluster cleaning method and its characterization

Choi, Hyun‐Sik; Kim, Hojoong; Yoon, Deok-Joo; Lee, Jong W.; Kang, Byung Hee; Kim, Minsu; Park, Jin-Goo; Kwon, Soon−Bark; Kim, Taesung

doi:10.1016/j.mee.2011.12.007

Cited by 18 publications

(11 citation statements)

References 11 publications

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“…In order to make effective use of the high performance of such cryogenic solid particles in the field of advanced nano technology, our laboratory has developed a new physical semiconductor cleaning method which employs cryogenic spray [3]. Especially in recent years, with the progress of high aspect ratio and fine cantilever in semiconductor nano structures, the ultimate cleaning method without use of water is strongly expected [4].…”

Section: Introductionmentioning

confidence: 99%

Development of Environmental Harmony Resist Removal System using Cryogenic Particulate Spray

Ishimoto

Horibe

2015

J. Photopol. Sci. Technol.

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Section: Introductionmentioning

confidence: 99%

Development of Environmental Harmony Resist Removal System using Cryogenic Particulate Spray

Ishimoto

Horibe

2015

J. Photopol. Sci. Technol.

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“…Especially, with progress in the use of a high aspect ratio and a fine cantilever in semiconductor nano structures, development of a cleaning method in which no water is used is strongly desired [4]. Because of the capillary force due to the surface tension of water that remains in the structure in the process of drying, the fine structure is deformed by capillary force, finally causing collapse or adhesion.…”

Section: Introductionmentioning

confidence: 99%

Ultra-high heat flux cooling characteristics of cryogenic micro-solid nitrogen particles and its application to semiconductor wafer cleaning technology

Ishimoto¹,

Oh²,

Zhao³

et al. 2014

AIP Conference Proceedings

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Abstract. The ultra-high heat flux cooling characteristics and impingement behavior of cryogenic micro-solid nitrogen (SN 2 ) particles in relation to a heated wafer substrate were investigated for application to next generation semiconductor wafer cleaning technology. The fundamental characteristics of cooling heat transfer and photoresist removal-cleaning performance using micro-solid nitrogen particulate spray impinging on a heated substrate were numerically investigated and experimentally measured by a new type of integrated computational-experimental technique. This study contributes not only advanced cryogenic cooling technology for high thermal emission devices, but also to the field of nano device engineering including the semiconductor wafer cleaning technology.

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“…Especially in the recent, with the progress of high aspect ratio and fine cantilever in semiconductor nano structures, the ultimate cleaning method without use of water is strongly expected (4). Because of the capillary force due to the surface tension of water that remains in the structure in the process of drying, the fine structure is deformed by the capillary force, finally causing collapse or adhesions.…”

Section: Introductionmentioning

confidence: 99%

Cryogenic Single-Component Micro-Nano Solid Nitrogen Particle Production Using Laval Nozzle for Physical Resist Removal-Cleaning Process

Ishimoto

Koike

et al. 2013

ECS Trans.

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The innovative characteristics of the cryogenic single-component micro-nano solid nitrogen (SN 2 ) particle production using super adiabatic Laval nozzle and its application to the physical resist removal-cleaning process are investigated by a new type of integrated measurement coupled computational technique. The originality to be noted in the present study is that the continuous production of micro-nano SN 2 particle is achieved by using single component gas-liquid two-phase flow of subcooled nitrogen through a Laval nozzle (converging-diverging nozzle). As a result of present computation, it is found that high-speed ultra-fine SN 2 particle is continuously generated due to the freezing of liquid nitrogen (LN 2 ) droplet induced by rapid adiabatic expansion of subsonic subcooled two-phase subcooled nitrogen flow passing through the Laval nozzle. Furthermore, the effect of SN 2 particle diameter, injection velocity, and attack angle to the wafer substrate on resist removal-cleaning performance is investigated in detail by integrated measurement coupled computational technique.

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Development of CO2 gas cluster cleaning method and its characterization

Cited by 18 publications

References 11 publications

Development of Environmental Harmony Resist Removal System using Cryogenic Particulate Spray

Development of Environmental Harmony Resist Removal System using Cryogenic Particulate Spray

Ultra-high heat flux cooling characteristics of cryogenic micro-solid nitrogen particles and its application to semiconductor wafer cleaning technology

Cryogenic Single-Component Micro-Nano Solid Nitrogen Particle Production Using Laval Nozzle for Physical Resist Removal-Cleaning Process

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