“…For food-grade packaging material, the technical requirements are increasing [ 2 , 3 ]. At present, Europe, the United States, Japan, South Korea, and other countries have carried out much research on PCS materials, including the PCS coating process [ 4 , 5 ], coating quality characterization [ 6 , 7 ], heat transfer during the coating process [ 8 ], PCS heat treatment [ 9 ], PCS application [ 10 ], film surface modification [ 11 ] and so on. In this paper, the micro-interface bonding mechanism of PCS is studied by the method of coating experiment combined with simulation.…”