Development of a Vibration Device for Grinding with Microvibration

Zhong, Zhi‐Rong; Yang, Hui-Chen

doi:10.1081/lmmp-200035263

Cited by 3 publications

(4 citation statements)

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“…A microvibration device developed [12] was employed for grinding of singlecrystal silicon. Three vibration parameters, namely, vibration direction, frequency, and amplitude, were investigated.…”

Section: Resultsmentioning

confidence: 99%

“…The initial experimental results verified the effect of the grinding with microvibrations on the surface finish of the ground silicon. However, improvement such as increase in the stiffness of the device and more grinding experiments using a better power amplifier were needed [12]. This has led to further studies and more experiments, which are reported in this paper.…”

Section: Figurementioning

confidence: 89%

“…The microvibration device used [12]. (Without vibrations) --A microvibration device was designed and fabricated to facilitate grinding experiments for analyzing the effect of workpiece microvibrations on surface finish.…”

Section: Figurementioning

confidence: 99%

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Grinding of Single-Crystal Silicon Using a Microvibration Device

Zhong

Rui

2005

Materials and Manufacturing Processes

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This paper presents experimental results of grinding of single-crystal silicon using a microvibration device and a diamond grindingwheel. Samples were cut from (100) silicon. The grinding direction was parallel to the [110] direction of (100) silicon. These samples were ground under the same grinding conditions but with different vibration directions, frequencies, and/or amplitudes. The surface roughness and the surface texture of all samples were analyzed for comparison. The R a , R q , and R t values and the microphotographs of the ground silicon surfaces showed the dependency of surface finish on the grinding with vibrations. Samples ground with vibrations had better surface finish compared with the silicon surfaces ground without vibrations. Out of the 12 experiments, the best surface finish was achieved when (100) silicon was ground with horizontal vibrations at a 70-Hz frequency and 6-m amplitude perpendicular to the grinding direction.

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Section: Resultsmentioning

confidence: 99%

Section: Figurementioning

confidence: 89%

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Grinding of Single-Crystal Silicon Using a Microvibration Device

Zhong

Rui

2005

Materials and Manufacturing Processes

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“…This method needs long processing time and high operating cost [5]. (d) Diamond turning with Fast Tool Servo (FTS) system or Slow Slide Servo (S 3 ).…”

Section: Introductionmentioning

confidence: 99%

Parameters Optimization for Machining Optical Parts of Difficult-To-cut Materials by Genetic Algorithm

Zhou

et al. 2014

Materials and Manufacturing Processes

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In this paper, three-dimensional (3D) elliptical vibration cutting (EVC) method is presented to fabricate optical parts of difficult-to-cut materials, which vibrates the diamond tool at a 3D ellipse trajectory driven by the nonresonant principle. The surface quality of the workpiece is determined by the elliptical motion parameters of the cutting tool. So this paper adopts genetic algorithm (GA) to optimize ellipse parameters to get better surface quality. An optimization model is established to minimize the surface roughness of the workpiece. And the validity of the proposed approach is verified by a numerical example. This research can direct designers to choose the optimum ellipse parameters to machine optical parts in the cutting experiments.

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Study of milling force variation in ultrasonic vibration-assisted end milling

Shen

2017

Materials and Manufacturing Processes

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Development of a Vibration Device for Grinding with Microvibration

Cited by 3 publications

References 0 publications

Grinding of Single-Crystal Silicon Using a Microvibration Device

Grinding of Single-Crystal Silicon Using a Microvibration Device

Parameters Optimization for Machining Optical Parts of Difficult-To-cut Materials by Genetic Algorithm

Study of milling force variation in ultrasonic vibration-assisted end milling

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