Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding

Daido, Izumi; Watanabe, Ryota; Takahashi, Toshio; Hatai, Munehiro

doi:10.1109/ectc32696.2021.00120

Cited by 12 publications

(2 citation statements)

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“…The N 2 by-products produced by the tape ablated by a 355 nm laser can assist in the separation of wafer bonding pairs. The improved tape was developed for hybrid bonding, which has greater thermal stability, tensile modulus and other properties [90]. The wafers bonded by this adhesive were thinned from 725 µm to 25 µm, and the TTV value was only 3 µm.…”

Section: Laser Ablationmentioning

confidence: 99%

“…The dislocation or incomplete connection of the TSV leads to the degradation of chip performance or loss of function. Sekisui reported their temporary adhesive tape that could withstand over 300 • C, which is available for Cu-Cu bonding [90]. The glass-adhesive-wafer stack was heated on a hot plate at 300 • C for 30 min, and no delamination was observed after heating.…”

Section: Tsv and Cu-cu Bondingmentioning

confidence: 99%

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Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Section: Laser Ablationmentioning

confidence: 99%

Section: Tsv and Cu-cu Bondingmentioning

confidence: 99%