Development of a Software Do-TRIZ for TRIZ Learning

Kim, Eun-Gyung; Koo, Bon-Chul; Kim, Young‐Jin

doi:10.6109/jkiice.2015.19.8.1883

Journal of the Korea Institute of Information and Communication

2015

DOI: 10.6109/jkiice.2015.19.8.1883

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Development of a Software Do-TRIZ for TRIZ Learning

Eun-Gyung Kim¹,

Bon-Chul Koo²,

Young‐Jin Kim³

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2023

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“…문제 분석 방법인 CECA 분석은 반도체 산업에서 문제 해결에 많이 사용이 되고 있다. 또한 기술적 모순과 물리적 모순 및 IFR을 기반으로 문제를 해결할 수 있는 프로세스 기반의 문제 해결 모듈이 구현되어 있어 기업에서 관심이 많은 문제 해결 방법이다 [7]. 이러한 여러 가지 방법으로 TRIZ는 문제를 체계적으로 분석할 수 있으며, 과학적이며 논리적으로 문제를 해결할 수 있도록 도와준다 [8].…”

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Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions

Ko,

Song,

Shim

et al. 2023

APJCRI

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Demand for high-performance semiconductors is increasing as related industries develop with the commercialization of METAVERSE and Chat GPT. Such high performance semiconductors are manufactured with great precision. A very small problem in precision manufacturing can be catastrophic. Therefore, the root cause of any problem that occurs in the semiconductor manufacturing process is found and eliminated. This paper deals with cases of production defects caused by leakage of epoxy mold compound (EMC), which is a molding resin in the encapsulation process, which is one of the semiconductor post-processes. In order to find the root cause of low temperature and melting point, we used functional analysis and CECA (Cause-effect chain analysis) analysis, which are representative analytical methods of TRIZ. The effects of various influencing factors were functionally created, functional diagrams showing interactions were created and classified, and the causes of influencing factors were found based on the classified contents and analyzed in detail by CECA analysis. The analyzed true cause derives physical contradiction based on technical contradiction, utilizes part-whole separation principle to transform pellet-like EMC into powder form, low viscosity while maintaining existing process temperature presented a concrete solution that can be transformed into a melt of As a result, leakage of the epoxy mold compound was dramatically improved, thus improving the reliability of the injection fluidity test.

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unclassified

Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions

Ko,

Song,

Shim

et al. 2023

APJCRI

View full text Add to dashboard Cite

show abstract

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Development of a Software Do-TRIZ for TRIZ Learning

Cited by 1 publication

References 1 publication

Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions

Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions

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