Solving Reliability Problems of Transfer Molding Press Equipment Using TRIZ Contradictions

Abstract

Demand for high-performance semiconductors is increasing as related industries develop with the commercialization of METAVERSE and Chat GPT. Such high performance semiconductors are manufactured with great precision. A very small problem in precision manufacturing can be catastrophic. Therefore, the root cause of any problem that occurs in the semiconductor manufacturing process is found and eliminated. This paper deals with cases of production defects caused by leakage of epoxy mold compound (EMC), which is a molding resin in the encapsulation process, which is one of the semiconductor post-processes. In order to find the root cause of low temperature and melting point, we used functional analysis and CECA (Cause-effect chain analysis) analysis, which are representative analytical methods of TRIZ. The effects of various influencing factors were functionally created, functional diagrams showing interactions were created and classified, and the causes of influencing factors were found based on the classified contents and analyzed in detail by CECA analysis. The analyzed true cause derives physical contradiction based on technical contradiction, utilizes part-whole separation principle to transform pellet-like EMC into powder form, low viscosity while maintaining existing process temperature presented a concrete solution that can be transformed into a melt of As a result, leakage of the epoxy mold compound was dramatically improved, thus improving the reliability of the injection fluidity test.