Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

Braun, T.; Le, Thi Huyen; Rossi, Marco; Ndip, Ivan; Holck, O.; Becker, Karl‐Friedrich; Böttcher, M.; Schiffer, Michael; Aschenbrenner, R.; Müller, Friedrich; Voitel, Marcus; Schuster, Martin; Wieland, Marcel; Goetze, Christian; Trewhella, Jean; Berger, Daniel

doi:10.1109/ectc32696.2021.00317

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Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

Cited by 13 publications

References 7 publications

State-Of-The-Art of Advanced Packaging

State-Of-The-Art of Advanced Packaging

Multiple System and Heterogeneous Integration with TSV-Less Interposers

Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP through Experimental and Numerical Investigations

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