Dynamic wetting by liquids on solid
surfaces depends on several
aspects such as surface energy, roughness, and interfacial tension,
among many others. Copper (Cu), gold (Au), aluminum (Al), and silicon
(Si) are a few of the most important metals that are used extensively
as substrates in various industrial and biomedical applications. Metals
are etched frequently on different crystal planes for fabrication
purposes. Etching exposes distinct crystal planes that may come in
contact with the liquids when used for different applications. The
interaction of the crystal planes with the liquid that comes in contact
with the solid dictates the wetting behavior of the surface. This
necessitates the importance of understanding how various crystal planes
of the same metals behave under similar conditions. Herein, three
specific crystal planes, namely, (1 0 0), (1 1 0), and (1 1 1), are
investigated at a molecular scale for the above-mentioned metals.
The dynamic contact angle and contact diameter trends revealed that
the relatively hydrophobic surfaces (Cu, Si) tend to reach their equilibrium
contact angle faster compared to the hydrophilic substrates (Al, Au).
Molecular kinetic theory is used to estimate the three-phase contact
line friction which is found to be higher for (1 1 1) planes. Further,
a consistent potential energy distribution variation is observed for
the crystal lattice of (1 0 0), (1 1 0), and (1 1 1). These findings
can be used as a guideline to determine the factors needed to completely
describe a dynamic wetting phenomenon of the droplet over the different
crystal planes. The understanding will be of great use in deciding
experimental strategies where fabricated different crystal planes
would be required to have a liquid contact.