2000
DOI: 10.1002/1521-4095(200012)12:23<1769::aid-adma1769>3.0.co;2-5
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Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

Abstract: For faster, smaller, and higher performance integrated circuits, a low dielectric constant insulator is required to replace silicon dioxide. Here the properties of a new dielectric—SiLK resin, a solution of a low‐molecular‐weight aromatic thermosetting polymer—are reviewed and examples of its application in the fabrication of interconnect structures, such as the one shown in the Figure, are given.

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Cited by 337 publications
(236 citation statements)
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“…For many applications of the integrated material structures, wrinkling is undesirable as it may lead to failure by delamination or fracture (e.g., Suo, 1995;Martin et al, 2000;Mumm et al, 2001;Yin et al, 2003;Peterson, 2006). On the other hand, wrinkling has also been exploited as an enabling mechanism for a variety of applications, such as stretchable electronics (Watanabe et al, 2002;Lacour et al, 2003;Choi et al, 2007), micro/nanoscale surface patterning (Huck et al, 2000;Serrano and Cahill, 2002;Ohzono and Shimomura, 2004;Chan and Crosby, 2006), optical phase grating , microfluidic sieves (Efimenko et al, 2005), smart adhesion (Chan et al, 2008), and metrology aid for measuring mechanical properties of thin films .…”
Section: Introductionmentioning
confidence: 99%
“…For many applications of the integrated material structures, wrinkling is undesirable as it may lead to failure by delamination or fracture (e.g., Suo, 1995;Martin et al, 2000;Mumm et al, 2001;Yin et al, 2003;Peterson, 2006). On the other hand, wrinkling has also been exploited as an enabling mechanism for a variety of applications, such as stretchable electronics (Watanabe et al, 2002;Lacour et al, 2003;Choi et al, 2007), micro/nanoscale surface patterning (Huck et al, 2000;Serrano and Cahill, 2002;Ohzono and Shimomura, 2004;Chan and Crosby, 2006), optical phase grating , microfluidic sieves (Efimenko et al, 2005), smart adhesion (Chan et al, 2008), and metrology aid for measuring mechanical properties of thin films .…”
Section: Introductionmentioning
confidence: 99%
“…Phenylethynyl-substituted aromatic systems for preparation of thermostable resins in which the phenylethynyl groups are oriented ortho to each other have lower temperatures for the onset of polymerization, and thus the hazards of handling are reduced (26). Replacement of the phenyl group with a pyridine should enhance the reactivity of the carbon-carbon triple bond in polymerization reactions.…”
Section: Vol 69 2003 Production Of 6-phenylacetylene Picolinic Acidmentioning
confidence: 99%
“…The goal of the work described here was to synthesize a more complex molecule, 6-phenylacetylene picolinic acid [6-(2-phenylethynyl)pyridine-2-carboxylic acid]. The potential reactivity of 6-phenylacetylene picolinate as a cross-linker or a dienophile makes it a good candidate to replace phenylacetylenes as endcapping agents for high-performance thermosetting polymers for aerospace applications (17) and electronic packaging (26). The strong electron-withdrawing properties of the pyridine moiety are predicted to allow lower reaction temperatures and shorter cure times during Diels-Alder-type polymerization.…”
mentioning
confidence: 99%
“…This fact is brought to attention recently in the development of low dielectric constant polymers for interconnect structures [41]. These authors coat a silicon wafer with a polymer layer, and then deposit a SiN thin film on the polymer, with the SiN film under a compressive residual stress.…”
Section: Equilibrium Wrinklesmentioning
confidence: 99%