2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM) 2017
DOI: 10.1109/aim.2017.8014028
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Development of a distributed Bernoulli gripper for ultra-thin wafer handling

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Cited by 8 publications
(8 citation statements)
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“…However, we noted that many handling steps in the improved procedures in [38] were completed manually, which will scale up to mass production. Thus, the first key innovation area for yield loss reduction is to improve wafer handling technologies, such as non-contact Bernoulli gripper [39]. Wafer handling is even more essential for wafers thinner than 80 µm due to the extremely high breakage rate.…”
Section: Why Is Thin Si Not Here Yet? Challenges and Innovation Oppor...mentioning
confidence: 99%
“…However, we noted that many handling steps in the improved procedures in [38] were completed manually, which will scale up to mass production. Thus, the first key innovation area for yield loss reduction is to improve wafer handling technologies, such as non-contact Bernoulli gripper [39]. Wafer handling is even more essential for wafers thinner than 80 µm due to the extremely high breakage rate.…”
Section: Why Is Thin Si Not Here Yet? Challenges and Innovation Oppor...mentioning
confidence: 99%
“…A distinctive element of JGDs is the presence of the annular gap in the plane of their end face -Ozcelik, Erzincanli (2002; Mykhailyshyn, Xiao (2022); Ozcelik et al (2003); Brun, Melkote (2006; Renn et al (2008); Toklu, Erzincanli (2012); Giesen et al (2013); Liu et al (2017Liu et al ( , 2019; Savkiv et al (2019aSavkiv et al ( , 2019b; Mechatronic Systemtechnik GmbH (2021). Load-bearing characteristics of these grippers exceed those of the previous ones; therefore, they are used for gripping parts weighing up to 10 kg.…”
Section: Classification Of Jgdsmentioning
confidence: 99%
“…In [42,[66][67][68][69][70][71][72][73], the authors investigate this question from the point of view of minimizing the energy costs for manipulating objects along different trajectories. Another direction of BGD research is on the substantiation of the parameters of the structural elements and the influence of the parameters of gripping devices on power characteristics [55,56,[74][75][76][77][78][79][80][81][82]]. Brun's articles [74][75][76] substantiate the effect of the BGD parameters on the deformation of the manipulated object at various input pressures.…”
Section: Introductionmentioning
confidence: 99%
“…Brun's articles [74][75][76] substantiate the effect of the BGD parameters on the deformation of the manipulated object at various input pressures. The influence of the parameters of the gripping surface with slots on the possibility of gripping flexible and thin objects is investigated in articles [55,[76][77][78]. In reference [79], the influence of the parameters of the friction elements on the power characteristics of BGDs with cylindrical nozzles is discussed.…”
Section: Introductionmentioning
confidence: 99%