Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Abstract

Outdoor digital displays have become increasingly popular and common for smart city applications, and more recently provides a concealment solution and integration point for outdoor communications devices meant to be attached to buildings, streetlamps, or traffic poles. Given the larger energy requirements for powering next generation 5G cellular networks, these devices create unique difficulties in developing and evaluating thermal management solutions. The present study develops and validates the extreme condition transient (ECT) climate model using a CFD/HT numerical model, to evaluate diurnal thermal responses from a representative 5G small cell devices. The model is validated for local conditions present in Atlanta, GA for two unique days. The thermal response from the ECT climate model is presented alongside three real case study locations, Miami, FL, New York City, NY, and Phoenix, AZ.

Innovative Approaches to Thermal Management in Next-Generation Electronics

“…Traditional cooling methods, which have long served as the foundation of thermal management, are proving to be woefully inadequate in the face of the increasing heat concerns brought on by next-generation electronics. These tried-and-true techniques, which were formerly successful at dissipating heat from electronic components, are now having a hard time keeping up with the lightning-fast improvements in device capabilities and power densities [16].…”

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

“…However, as packing densities increase, effectively managing heat dissipation between SiP chips and addressing the self-heating of individual chips becomes vital. This is crucial due to the adverse effects high temperatures can have on performance and reliability [9][10][11][12]. Therefore, researchers and electronic developers have turned their attention to thermal management problems in SiP implementations.…”