Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

Chen, Liang; Deng, Daxiang; Huang, Qingsong; Xu, Xinhai; Xie, Yingxi

doi:10.1016/j.applthermaleng.2019.114686

Cited by 51 publications

(15 citation statements)

References 45 publications

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“…Chen et al [72] developed a flat heat spreader with radial multiarterial reentrant microchannel for high-power LED cooling. The flat heat spreader was made of a sintered particle wick with microchannels implemented.…”

Section: Effects Of Inclinationmentioning

confidence: 99%

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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As the cooling capacity of the active cooling devices has reached their allowable heat flux limit, heat spreading technologies are becoming more remarkable in the thermal management of high-power electronics. Flat plate two-phase heat spreaders (FTHSs) are advantageous for the thermal management of electronic devices due to their simplicity, powerfree operation, and high reliability. This review is based on understanding the working mechanism and limitations of FTHSs. As the power density of electronic devices increases, researchers focus on performance improvement to overcome their malfunctioned working conditions. This review summarizes the major parameters of FTHS that affect heat transfer performance. Moreover, recent advances in FTHSs suggest that new design concepts can extend the maximum operating heat flux of thermal management devices. This review can establish a direction for studying higher-performance heat spreaders and identifying the latest trends.

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Section: Effects Of Inclinationmentioning

confidence: 99%

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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“…They wanted to see how the filling ratio and interior space affected the results. Chen et al [42] investigated the circular plate type vapor chamber for LED cooling and found that the 3 mm thick vapor chamber cooling system can lower thermal resistance by 19-48 percent. Li et al [43] also attempted a numerical analysis of the disk type vapor chamber with grooved wick construction.…”

Section: Introductionmentioning

confidence: 99%

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

et al. 2022

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In the current study, a hemispherical shell vapor chamber (HSVC) was proposed and manufactured. A unique system of the HSVC consists of a very short evaporator space and a large condenser area with an inner and outer surface. The HSVC has a bottom surface that can be easily attached to the heat source and its radius varies from 0.045 m (near the bottom surface) to 0.078 m at the top with a curved side. An entirely new design of the integrated section of the large condenser with the evaporator section was verified using a new but simple concept. The current hemispherical shell vapor chamber (HSVC) was made from stainless steel. The current HSVC was specified with an outer/inner diameter of 78/70 mm at the top, a depth of 47 mm in the inner surface area, a total height of 60 mm, 30 mm at the bottom of the inner center, and a diameter of 45 mm on the surface of the outer bottom area. Three different models were manufactured and tested to verify which HSVC reached a high thermal performance. The effects of various operation parameters such as the filled volume ratio, heat load, coolant flow velocity, orientation, and so forth, were investigated experimentally. The experimental results showed that the optimum charge amount in terms of temperature difference is 20–30% of the charging ratio, and the condenser area has a direct effect on the thermal performance. Moreover, a one-dimensional thermal resistance model was tested to predict and simulate the thermal performance of the current system associated with various empirical correlations. Furthermore, the CFD (Computational Fluid Dynamics) model can simulate a lot of detailed flow behavior inside the HSVC. Both simulation methods can predict the thermal performance of the HSVC, and they can help to design the system with a focus on the optimum configuration of the design target for any application.

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“…A vapor chamber is a superior cooling device that has ability more than a traditional heat sink. The vapor chamber is used in electronic cooling application such as hard disk drive cooling of PCs (Naphon et al, 2013), high-power LED (Chen et al, 2020;Wang., 2011;Tang et al, 2017), avionics applications (Reyes et al, 2012) cylindrical Li-ion battery pack (Liu et al, 2019;Gou and Liu., 2019), LED automotive headlamps (Lu et al, 2019), IGBT power module (Chen et al, 2019), a central processing unit of the PCs (Naphon et al, 2012), and mobile (Patankar et al, 2016). To obtain the minimum thermal resistance of the vapor chamber, it depends on the operating power, fill ratio, geometries, material types of heat sinks, configuration structures of the vapor chamber (Wiriyasart and Naphon, 2018a;Ming et al, 2009), heating areas, and heating modes (Tang et al, 2013).…”

Section: Introductionmentioning

confidence: 99%

Transient thermal performance of constant fill ratio vapor chamber with different coolants

Wiriyasart

Naphon

2021

JTST

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In this study, a constant fill ratio vapor chamber using water and ferrofluid as the coolants on the thermal performance and thermal optimization to provide the cooling range are presented. The liquid flow rate of the condenser side ranges from 0.029−0.099 kg/s, the input power of 100−300 W, heat source size of 30 mm × 30 mm, and the water and ferrofluid with φ=0 %, φ=0.005 % and φ=0.05 % as coolants are investigated. The results indicate that the minimum thermal resistance of a traditional vapor chamber of 0.126 o C/W at m o = 0.075 kg/s and vapor chamber with a mini channel of 0.077 o C/W at m o = 0.049 kg/s at φ=0.005 % are obtained. The vapor chamber with and without mini channel at a certain fill ratio of 26 % and 33 %, the heat source size of 30 mm × 30 mm, and the mass flow rate of ≥ 0.042 kg/s are withstanding the heat load range from 100-200 W. However, to achieve the high heat load range from 100-300 W, the vapor chamber with mini channel using the Fe3O4 ferrofluid φ=0.005 % is covering the entire cooling range and is recommended in electronic cooling applications.

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Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

Cited by 51 publications

References 45 publications

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Thermal Investigations of Hemispherical Shell Vapor Chamber Heat Sink

Transient thermal performance of constant fill ratio vapor chamber with different coolants

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