Development and Characterization of Plating Cell Geometry for PCB and Packaging Applications.

Garich, Holly; Gebhart, Larry; Taylor, E. Jennings; Inman, Maria; McCrabb, Heather

doi:10.1149/1.2721499

Cited by 5 publications

(4 citation statements)

References 3 publications

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“…Finally, a cavity or slit appears in the microvia to reduce the reliability of PCB products (Pohjoranta and Tenno, 2014). To improve the performance of microvia filling, we usually take two measures during actual electrodeposition (Garich et al, 2007;Broekmann et al, 2011). One is to optimize electroplating product line and electroplating process.…”

Section: Introductionmentioning

confidence: 99%

Mechanism analysis of microvia filling based on multiphysics coupling

Shidong

Nie

et al. 2018

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Purpose Copper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodeposition. Because a large number of factors are included in electrodeposition, experimentally determining all parameters and electrodeposition conditions becomes unmanageable. Therefore, a multiphysics coupling technology was introduced to investigate microvia filling process, and the mechanism of copper electrodeposition was analyzed. The results provide a strong theoretical basis and technical guidance for the actual electroplating experiments. The purpose of this paper is to provide an excellent tool for quickly and cheaply studying the process behavior of copper electrodeposition without actually needing to execute time-consuming and costly experiments. Design/methodology/approach The interactions among additives used in acidic copper plating solution for microvia filling and the effect on the copper deposition potential were characterized through galvanostatic measurement (GM). The adsorption behavior and surface coverage of additives with various concentrations under different rotating speeds of working electrode were investigated using cyclic voltammetry (CV) measurements. Further, a microvia filling model was constructed using multiphysics coupling technology based on the finite element method. Findings GM tests showed that accelerator, inhibitor and leveler affected the potential of copper electrodeposition, and bis(3-sulfopropyl) disulfide (SPS), ethylene oxide-propylene oxide (EO/PO) co-polymer, and self-made leveler were the effective additives in acidic copper plating solution. CV tests showed that EO/PO–Cu+-Cl− complex was adsorbed on the electrode surface by intermolecular forces, thus inhibiting copper electrodeposition. Numerical simulation indicated that the process of microvia filling included initial growth period, the outbreak period and the stable growth period, and modeling result was compared with the measured data, and a good agreement was observed. Research limitations/implications The research is still in progress with the development of high-performance computers. Practical implications A multiphysics coupling platform is an excellent tool for quickly and cheaply studying the electrodeposited process behaviors under a variety of operating conditions. Social implications The numerical simulation method has laid the foundation for mechanism of copper electrodeposition. Originality/value By using multiphysics coupling technology, the authors built a bridge between theoretical and experimental study for microvia filling. This method can help explain the mechanism of copper electrodeposition.

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Section: Introductionmentioning

confidence: 99%

Mechanism analysis of microvia filling based on multiphysics coupling

Shidong

Nie

et al. 2018

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“…Faraday Technology has engineered and built a novel plating cell geometry (the FARADAYIC ElectroCell) that enables uniform metallization of 450 mm x 600 mm PCB substrates (1). Previous work demonstrated a high level of boundary layer thickness uniformity that results in high levels of deposit thickness uniformity (2,3). Furthermore, previous work has also demonstrated the necessary combination of ElectroCell components for optimal deposit thickness uniformity (4).…”

Section: Introductionmentioning

confidence: 99%

Alternating Flow Patterns for Copper Plating Uniformity

Garich¹,

Gebhart²,

Snyder³

et al. 2010

ECS Trans.

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The need for smaller and faster electronic circuits is driving the design of printed circuit board (PCB) interconnects in the direction of finer pitch transmission lines, smaller diameter through holes and vias, and thicker boards with higher layer counts to provide increased circuit densities. Many of the major defects associated with the manufacture of semiconductors and PCBs may be attributed to poor mechanical quality of z-interconnects. Faraday Technology is coupling patented cell geometry with alternating flow schemes to address copper metallization for shrinking interconnect dimensions. Preliminary modeling work provided the initial switching frequency and flow rate targets for the experimental optimization work that is currently underway. This work is anticipated to improve copper metallization uniformity in high aspect ratio z-interconnects, resulting in improved throwing power and mechanical properties as compared to currently available plating cell geometries and agitation mechanisms.

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“…Traditional air sparging agitation gave rise to eductor agitation, though both are currently used in commercial plating cell geometries. Eductor flow is achieved with any number of plating cell geometries, however, the configuration may adversely impact plating performance in poorly utilized eductor schemes (6).…”

Section: Introductionmentioning

confidence: 99%

Novel Plating Cell Geometry for Uniform Metal Distribution

Garich¹,

Gebhart²,

Snyder³

et al. 2009

ECS Trans.

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Faraday Technology, Inc. has developed a number of novel processing cells based on an innovative cell geometry that results in high levels of processing uniformity. This geometry is comprised of a number of unique attributes for the uniform electrodeposition or electroetching of metals across large planar substrates as well as fine features that are utilized for printed circuit board (PCB) and electronic packaging applications. The cell has been characterized with a 457 mm x 610 mm substrate. A coefficient of variation of 5.3% was achieved in FARADAYIC® ElectroCell over a 457 mm x 610 mm substrate; these values were compared to a commercial system. This cell design has been applied to a number of industrial processes, including electroplating of copper, trivalent chromium and platinum and electroetching of copper for interlayer circuit board applications. The current work outlines the importance of various cell components and resulting uniformity.

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Development and Characterization of Plating Cell Geometry for PCB and Packaging Applications.

Cited by 5 publications

References 3 publications

Mechanism analysis of microvia filling based on multiphysics coupling

Mechanism analysis of microvia filling based on multiphysics coupling

Alternating Flow Patterns for Copper Plating Uniformity

Novel Plating Cell Geometry for Uniform Metal Distribution

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