2017
DOI: 10.1016/j.solmat.2016.08.030
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Determining influences of SiO2 encapsulation on thermal energy storage properties of different phase change materials

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Cited by 109 publications
(33 citation statements)
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“…Leakage can be seen as a common problem for all PCMs that make them difficult to integrate into systems where materials undergo a phase change . The impregnation of PCMs into porous materials, development of solid‐solid PCMs, and encapsulation of PCMs has been the most preferred techniques to overcome leakage problem of PCMs . Among the PCM‐developing techniques, encapsulation allows easy and effective integration into many applications .…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Leakage can be seen as a common problem for all PCMs that make them difficult to integrate into systems where materials undergo a phase change . The impregnation of PCMs into porous materials, development of solid‐solid PCMs, and encapsulation of PCMs has been the most preferred techniques to overcome leakage problem of PCMs . Among the PCM‐developing techniques, encapsulation allows easy and effective integration into many applications .…”
Section: Introductionmentioning
confidence: 99%
“…4 The impregnation of PCMs into porous materials, development of solid-solid PCMs, and encapsulation of PCMs has been the most preferred techniques to overcome leakage problem of PCMs. 5 Among the PCM-developing techniques, encapsulation allows easy and effective integration into many applications. 6 Encapsulated PCMs in macro, micro, and nano sizes can be used in several applications, such as energy saving in buildings, 7 transportation of food 8 and medical stuff, 9 smart textile applications, 10 and electronics.…”
Section: Introductionmentioning
confidence: 99%
“…14 Although the polymer shell has high compatibility with PCMs and is simple to operate, it has not been widely used as a result of some main problems such as poor thermal conductivity, lack of rigidity, and flammability. 23,24 Microencapsulated PCM has been successfully prepared using alternative inorganic materials like CaCO 3 , TiO 2 , and graphene. 15 Therefore, in order to overcome the shortage of polymer shell, modification of the polymer shell of the microcapsules with inorganic materials can improve their properties.…”
Section: Introductionmentioning
confidence: 99%
“…22 In addition, using inorganic materials to encapsulate PCM has attracted more attention; there have been some reports involving the use of inorganic silica as a wall material for encapsulating PCM. 23,24 Microencapsulated PCM has been successfully prepared using alternative inorganic materials like CaCO 3 , TiO 2 , and graphene. [25][26][27] Wang et al and Jiang et al 25,26 encapsulated the PCM into a CaCO 3 shell and found that these rigid shell microcapsules achieved thermal conductivity enhancement.…”
Section: Introductionmentioning
confidence: 99%
“…Literature shows that melamine‐formaldehyde resin, urea formaldehyde, poly‐urethane, cellulose, chitosan, gelatine acacia, polymethyl methacrylate, SiO 2 , polycarbonate, and polystyrene have been used successfully as shell materials for PCMs and other encapsulation purposes as well. The existing encapsulated PCMs are for building applications addressing thermal comfort range of 22°C to 26°C.…”
Section: Introductionmentioning
confidence: 99%