2007
DOI: 10.3103/s1068366607010060
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Determination of temperature field in zone of cutting of diamond crystals by thermography

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Cited by 5 publications
(4 citation statements)
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“…Many of these systems, including microscale engineering systems, have dimensions of only a few micrometers or even tens of nanometers [1]. It has been shown that temperature measurements in earthquake physics [2], materials processes [3], diamond cutting [4], and hypersonic vehicles [5] also need to have a spatial resolution in the order of micrometers. Without a high spatial resolution and fast temperature measurement techniques, it is impossible to conduct experimental studies of the microscale thermal processes that occur in these systems.…”
Section: Introductionmentioning
confidence: 99%
“…Many of these systems, including microscale engineering systems, have dimensions of only a few micrometers or even tens of nanometers [1]. It has been shown that temperature measurements in earthquake physics [2], materials processes [3], diamond cutting [4], and hypersonic vehicles [5] also need to have a spatial resolution in the order of micrometers. Without a high spatial resolution and fast temperature measurement techniques, it is impossible to conduct experimental studies of the microscale thermal processes that occur in these systems.…”
Section: Introductionmentioning
confidence: 99%
“…In this study, we used a special tester, a compact infrared camera is mounted in the tester side. Unlike other end-face temperature measurement by thermography [3,4], this study investigated the temperature distribution at different depths into the specimen and combined results of thermocouple embedded in block to reduce the disadvantage of IR camera itself as well.…”
Section: Introductionmentioning
confidence: 99%
“…Temperature is an important parameter to be considered in many applications requiring high spatial resolution, for instance, microelectronics [ 18 , 19 , 20 ], combustion [ 21 , 22 ], electrical discharge machining [ 23 ], machining processes [ 5 , 6 , 7 , 24 ], laser beam separation [ 25 ] and diamond cutting [ 26 ]. Typically, in microelectronics, micro-Raman thermography is used for measuring the temperature of devices.…”
Section: Introductionmentioning
confidence: 99%
“…This also occurs in diamond cutting applications where the cutting zone is determined by the disc width (typically of 70 μm). These measurements are normally done with IR cameras [ 26 ] and the difficulty of knowing the target emissivity leads on to an inaccurate absolute temperature.…”
Section: Introductionmentioning
confidence: 99%