Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Abstract

Solder is a very common and important material for electronic packaging. The major function of the solder is to provide the electrical connection between different electrical components. In SMT assemblies, solder also provides the mechanical support. Self alignment property of solder joints is one of the advantages of using solder as the interconnection materials in SMT process. It can pull the initially misaligned component back to the desired position by surface tension of the solder during the reflow process.