A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials

Yusof, Ab Aziz bin Mohd; Januddi, Mohd Al Fatihhi Mohd Szali; Harun, Muhamad Noor

doi:10.1016/j.asej.2022.101769

Cited by 2 publications

(1 citation statement)

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“…In addition, the PCC between the maximum standoff and solder density was −0.631, indicating an ex- Yusuf et al studied the effect of various solder compositions (Sn-40Pb, Sn-3.5Ag, SAC105, SAC305, etc. ), surface tensions, densities, and geometry of solder bumps [229]. The range of solder density was 7.44 to 8.40 g/cm 3 , and that of the surface tension was 475-548 mN/m.…”

Section: Solder Bumpingmentioning

confidence: 94%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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Section: Solder Bumpingmentioning

confidence: 94%