Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

Chan, Yuen Sing; Lee, S. W. Ricky

doi:10.1109/esime.2010.5464516

Cited by 7 publications

(9 citation statements)

References 11 publications

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“…Solder Joint Figure 1 depicts the 1-D solder joint creep-fatigue model developed previously [6]. The mechanical response of the solder joint can be described by:…”

Section: Driving Blockmentioning

confidence: 99%

“…Figure 19 illustrates the FE model developed. The elastic-creep model is assumed for the SAC solder joints [6]. The material properties of the solder joints can be obtained from Table 1.…”

Section: Accumulated Equivalent Creep Strainmentioning

confidence: 99%

“…A 1-D analytical model developed earlier [6] will be employed to aid the study. Its stabilization behavior will be examined first.…”

Section: Introductionmentioning

confidence: 99%

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Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Chan

Lee

2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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The acquisition of a "stabilized" solution is necessary for the consistent evaluation of the solder joint thermal fatigue damage by the common finite element (FE) based modeling approaches. Yet, there are no universal guidelines developed for this purpose. The present study aims to provide insight into this subject. A 1-D analytical model is firstly developed for this study. The balance between the "forward creep strain" and the "backward creep strain" is observed to be the driving force that leads to solution stabilization of the 1-D model. Considerations are then made for the 2-D and 3-D cases. It is found that there is discrepancy in the solution behavior between the 1-D and the multi-dimensional situations. Accordingly, the von Mises creep strain may not appropriately reflect the stabilization status of the multidimensional models. The von Mises stress, therefore, is proposed to serve the purpose instead. A set of stabilization criteria is developed eventually. These criteria are expected to be universally applicable to all 2-D and 3-D solder joint thermal fatigue problems. As a demonstration, the criteria are implemented on a 2-D model for which the solder joint thermal fatigue damage of a custom-made assembly is evaluated. All analyses presented in this paper are based on the SnAgCu (SAC) lead-free solder.

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“…Solder Joint Figure 1 depicts the 1-D solder joint creep-fatigue model developed previously [6]. The mechanical response of the solder joint can be described by:…”

Section: Driving Blockmentioning

confidence: 99%

“…Figure 19 illustrates the FE model developed. The elastic-creep model is assumed for the SAC solder joints [6]. The material properties of the solder joints can be obtained from Table 1.…”

Section: Accumulated Equivalent Creep Strainmentioning

confidence: 99%

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Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Chan

Lee

2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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“…Engelmaier [5,6] demonstrates the use of a similar creep-fatigue model to calculate solder joint lifetime of products in the field. Chauhan [7] discusses several shortcomings of this model, including the fact that it is not appropriate for rapid cycles with cycle times of about 2 s. Chan and Lee [8] address the influence of cycle time in the context of accelerated testing, for a solder joint in cyclic tensile/compressive load. Syed [9] presents an overview of published constitutive equations for SnAgCu (SAC) solder, and uses FEM simulations to come to lifetime predictions for the case of solder ball geometry.…”

Section: Introductionmentioning

confidence: 99%

Solder joint lifetime of rapid cycled LED components

Luiten

2013

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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Solder joint reliability is one of the most important factors in the lifetime of electronic products. Typically solder joint lifetimes are expressed in numbers of cycles to failure, which are derived from accelerated temperature cycle tests. The extrapolation of test results from the test temperature range to the temperature range in operation is well known. In contrast, the effect of the time scale differences between the test and the operational condition is much more complicated and is often not taken into account. The present work addresses the effect of cycle-time on the solder fatigue. A 1D analytical model is made of a shear loaded solder joint, and a spreadsheet is used to calculate time dependent stress relaxation, including the highly nonlinear material behavior of lead free solder. The results are used to estimate safe engineering limits for lead free solder joints of LEDs driven in short time cycles typical for video signals in in a TV product. It is shown that above and below a certain threshold value the cycle time has no influence on the number of cycles to failure. When cycle times are very short, no solder creep occurs, and such cycles have no impact on the total number of cycles to failure. When cycles times are very long, solder creep occurs up to the stress free situation, and a maximum damage per cycle is incurred, corresponding to a minimum number of cycles to failure. Longer cycle times again do not impact this minimum number of cycles to failure. However when the cycle time allows for partial solder creep , the damage incurred in each cycle is less than the maximum and consequently the number of cycles to failure will be correspondingly higher, dependant on the cycle time.

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“…ATC test time can be reduced by some means such as decreasing the ramp period or decreasing the dwell period. The effect of each cycle parameter and the corresponding failure mechanisms have been the subject of many literatures [4][5][6]; However, uncertainty remains, especially the role of ramp period.…”

Section: Introductionmentioning

confidence: 99%

Investigation of strain rate effect on lifetime performance of wafer level CSP under different thermal cycling loading rate

Lin

Chiang

2014

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Solder joints are commonly used in the electronic packaging industry to provide electrical connection and serve as the mechanical support between a package and a printed circuit board (PCB). A coefficient of thermal expansion mismatch between component and board generates thermally induced strains in solder joints because of environmental temperature change, which ultimately causes fatigue failure. The reliability of solder joints is a primary subject. One of the common solder failures is the formation of fatigue crack at the interface between solder joints and component under accelerated tests by subjecting electronic assemblies to temperature cycling. Lead-free solder materials have a high homologous temperature, and the damage mechanism induced by creep failure should be considered.Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for reliability assessment. ATC decreases life cycle test time through different means, such as increasing the ramp rate or decreasing the dwell time. Fast temperature cycles can reduce the test time, but the effects of ramp rate causes a variation in material properties because of strain rate and stress change. However, JEDEC did not impose strict requirements in selecting an optimum temperature profile for temperature cycling, and previous inconsistent test temperatures may affect the reliability assessment of the solder joints. This study used linear temperature-dependent Young's modulus and Garofalo-Arrhenius creep equation to describe the solder deformation response. With the use of empirical Darveaux-based equations, the optimized mesh size in finite element model calculation was studied to accommodate the strain rate effect with different ramp rates.

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Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

Cited by 7 publications

References 11 publications

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Solder joint lifetime of rapid cycled LED components

Investigation of strain rate effect on lifetime performance of wafer level CSP under different thermal cycling loading rate

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